FERMILAB-TM-2227 Testing of the TriP Chip Running at 132 nsec Using a Modified AFE Board. J. Estrada, C. Garcia, B. Hoeneisen and P. Rubinov 26 November 2002 D∅ note 4076 1 Introduction In this note we describe the first set of tests done with a sample of TriP chips that were mounted on a modified AFE board. The modifications consisted of different firmware and the replacement of one power supply switch. The board used was a standard AFEIc board (red type) on which new MCMs (MCMIIs) were mounted. The new MCMs were designed to support the TriP and emulate the SVX for readout when mounted on an AFEIc board. The TriP and the MCMs are described in Ref. [1]. Two versions of the MCMII were designed and built: one (MCMIIb) supports two TriP chips wirebonded directly to the MCM substrate. The other, (MCMIIc) supports one TriP which can be either wirebonded directly or packaged into a standard TQFP surface mount package. Due to space constraints, this MCM can support only 1 TriP. 1