Accepted Manuscript Title: Experimental Investigation of the Daily Thermal Performance of a mPCM Honeycomb Wallboard Authors: Shiuan-Man Wang, Peter Matiaˇ sovsk´ y, Peter Mih´ alka, Chi-Ming Lai PII: S0378-7788(17)32904-3 DOI: https://doi.org/10.1016/j.enbuild.2017.10.080 Reference: ENB 8100 To appear in: ENB Received date: 25-8-2017 Accepted date: 23-10-2017 Please cite this article as: Shiuan-Man Wang, Peter Matiaˇ sovsk´ y, Peter Mih´ alka, Chi-Ming Lai, Experimental Investigation of the Daily Thermal Performance of a mPCM Honeycomb Wallboard, Energy and Buildings https://doi.org/10.1016/j.enbuild.2017.10.080 This is a PDF file of an unedited manuscript that has been accepted for publication. As a service to our customers we are providing this early version of the manuscript. The manuscript will undergo copyediting, typesetting, and review of the resulting proof before it is published in its final form. Please note that during the production process errors may be discovered which could affect the content, and all legal disclaimers that apply to the journal pertain.