Fullwafer technology for largescale laser processing and testing O. Voegeli, M. K. Benedict, G. L. Bona, P. Buchmann, N. Cahoon, K. Dätwyler, H. P. Dietrich, A. Moser, G. Sasso, H. K. Seitz, P. Vettiger, D. J. Webb, and P. Wolf Citation: Journal of Vacuum Science & Technology B 9, 2886 (1991); doi: 10.1116/1.585619 View online: http://dx.doi.org/10.1116/1.585619 View Table of Contents: http://scitation.aip.org/content/avs/journal/jvstb/9/6?ver=pdfcov Published by the AVS: Science & Technology of Materials, Interfaces, and Processing Articles you may be interested in Direct wafer bonding technology for large-scale InGaAs-on-insulator transistors Appl. Phys. Lett. 105, 043504 (2014); 10.1063/1.4891493 Solar pond technology for large-scale heat processing in a Chilean mine J. Renewable Sustainable Energy 4, 053115 (2012); 10.1063/1.4757627 Advances in the Understanding of the LargeScale Gap Test AIP Conf. Proc. 845, 944 (2006); 10.1063/1.2263477 FullWafer Defect Identification using Xray Topography AIP Conf. Proc. 683, 284 (2003); 10.1063/1.1622483 Fullwafer technology for laser fabrication and testing AIP Conf. Proc. 227, 146 (1991); 10.1063/1.40640 Redistribution subject to AVS license or copyright; see http://scitation.aip.org/termsconditions. Download to IP: 130.88.90.140 On: Fri, 19 Dec 2014 19:07:25