Materials Science and Engineering B21 (1993) 307-311 307
Photoluminescence and electroluminescence processes in Si I _ xGex/Si
heterostructures grown by chemical vapor deposition
J. C. Sturm, X. Xiao, Q. Mi, C. W. Liu, A. St. Amour and Z. Matutinovic-Krstelj
Department of Electrical Engineering, Princeton University, Princeton, NJ 08544 (USA)
L. C. Lenchyshyn and M. L. W. Thewalt
Simon Fraser University, Burnaby, B.C. V5A 1S6 (Canada)
Abstract
Well-resolved band-edge exciton photoluminescence has been observed in strained Si I xGexquantum wells on Si(100). A
growth technique which provides material with a low density of non-radiative centers and a uniform microstructure is
necessary for observing such luminescence. The luminescence exhibits a characteristic no-phonon line due to the alloy
randomness, and a threefold splitting of the transverse optical phonon mode due to different nearest neighbor inter-
actions. The luminescence has been observed from 2 to 300 K, and can also be electrically pumped (electroluminescence)
to over 300 K, with peak emission from 1.3 to 1.5/~m.
1. Introduction
Very-large-scale integrated circuits are made in sili-
con because of the excellent manufacturability of sili-
con devices and resulting low defect density over large
areas. The intrinsic electrical and optical properties of
silicon are rather poor, however (low mobilities, in-
direct band gap, etc.). Therefore considerable effort
has been focused over the last 10 years on developing a
silicon-based heterojunction technology for overcom-
ing these inherent limitations of silicon integrated cir-
cuits, with the most effective approach being that of
commensurately strained Sil_xGe x alloys on Si(100)
substrates. Heterojunction bipolar transistors made in
this material system at present exhibit fT values in
excess of 90 GHz at room temperature [1].
Although the growth of strained Sil_xGe x on
Si(100) has been actively pursued by many groups for
nearly a decade, it is only within the past 3 years that
well-resolved band-edge exciton luminescence has
been observed in this material. In 1990, exciton photo-
luminescence (PL) was reported from a fairly thick
strained layer with only 4 at.% Ge (x= 0.04) [2]. In
1991, such PL was clearly observed for the first time in
quantum wells (QWs) and superlattices (with x~ 0.2)
[3]. These latter samples were grown not by molecular
beam epitaxy, as in most of the previous Si-Ge lumin-
escence work, but rather by rapid thermal chemical
vapor deposition (RTCVD). This paper reviews the
RTCVD growth technique and the resulting Si-Ge
layer PL and electroluminescence (EL) from 2 to 300 K
and then finally suggests some future directions for
continuing research.
2. Rapid thermal chemical vapor deposition
RTCVD is a straightforward combination of rapid
thermal processing with conventional chemical vapor
deposition (CVD) (Fig. 1). A single 100 mm silicon
wafer is suspended on quartz pins inside a load-locked
quartz reaction tube and is heated by a bank of
tungsten-halogen lamps located outside the reactor
chamber. The typical source gases are dichlorosilane,
germane, diborane and phosphine in a hydrogen
carrier, and growth temperatures vary from 500 to
1200°C. (Unless otherwise noted, all results in this
paper are for Sil_xGe x grown at 625°C and Si at
700°C, at a pressure of 6 Tort.) The reactor has
several unusual features which are important to the
growth of high quality films. First, although the reactor
is not of an "ultrahigh vacuum" type (O-ring seals are
used and only a mechanical rotary vane pump is used
in normal operation), through the use of the load-lock
and ultrahigh purity gas handling, high quality epitaxial
layers with low oxygen concentrations (10 ~s cm 3 or
less) can be achieved at growth temperatures as low as
550 °C. (Oxygen contamination (concentrations levels
in excess of 10 ~8 cm -3) and related defects are a
common problem in silicon-based CVD at tempera-
tures below 900 °C.) Second, there is no possible source
of extrinsic contamination (such as metal wafer heaters
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