Experimental Study and Optimization of Process Parameters During WEDM Taper Cutting Anshuman Kumar, K. Abhishek, K. Vivekananda and Chandramani Upadhyay Abstract An experimental investigation has been performed on wire-EDM of Inconel 718 by using zinc-coated brass wire as tool electrode. Based on L 27 orthogo- nal array, the studies have been conducted by varying five process parameters (such as taper angle, pulse on-time, wire speed, wire tension, and discharge current), within the selected experimental domain. The following machining performance yields (viz. angular error and surface roughness) have been investigated during this study. The angular error (AE) and surface roughness (Ra) have been critical responses in die making industry. Simultaneously, the mathematical model has been developed by using nonlinear regression analysis for correlating with various process parameters and performance characteristics. Finally, JAYA algorithm has been applied individ- ually to find out the satisfactory machining performances. Application and potential of JAYA algorithm have been compared with Teaching-Learning based algorithm and Genetic Algorithm (GA) and observed by the JAYA algorithm, which does not require any specific parameter settings and hence easy to implement. Keywords WEDM · Taper cutting · Surface roughness · JAYA · TLBO · GA A. Kumar (B ) Department of Mechanical Engineering, Koneru Lakshmaiah Education Foundation, Vaddeswaram, Andhra Pradesh, India e-mail: anshu.mit06@gmail.com K. Abhishek Department of Mechanical Engineering, Institute of Infrastructure Research and Management (IITRAM), Ahmedabad, Gujarat, India K. Vivekananda Faculty of Science and Technology, Department of Mechanical Engineering, ICFAI Foundation for Higher Education, Hyderabad, Telangana state, India C. Upadhyay Department of Mechanical Engineering, National Institute of Technology, Rourkela, Rourkela, Odisha, India © Springer Nature Singapore Pte Ltd. 2019 J. C. Bansal et al. (eds.), Soft Computing for Problem Solving, Advances in Intelligent Systems and Computing 817, https://doi.org/10.1007/978-981-13-1595-4_57 721