Vol-7 Issue-5 2021 IJARIIE-ISSN(O)-2395-4396 15325 www.ijariie.com 294 DESIGN AND EXPERIMENTAL STUDY OF A MINIATURE VAPOUR COMPRESSION REFRIGERATION SYSTEM FOR CPU COOLING Nandakishor D. Bankar 1 , Gajanan P. Nagre 2 , Ujwal S. Lahane 3 , Sourabh G. Jaiwal 4 1,2,3 Lecturer in Mechanical Engineering Department, MGM’s Polytechnic, Aurangabad, MH, India 4 Field Service Engineer, Central Zone, Atlas Copco Pvt. Ltd., Pune, MH, India ABSTRACT The chip power continuously increases traditional passive heat dissipation techniques used in the old version but now new active cooling techniques are arising. Various new active cooling techniques, the Vapor Compression Refrigeration (VCR) system is the leading technology use in CPU. This project presents a miniature VCR system for CPU cooling. The dimension of the system is 300 × 230 ×70 mm3and its cooling capacity is 300 W. It includes a commercial miniature compressor, a capillary tube, a condenser, and an evaporator. The system is tested systematically by experiments. The results indicate that the temperature of the evaporator can be maintained at about 10̊C for hours as required in CPU cooling. A small refrigeration VCR system for cooling computer system components CPU is evaluated. The refrigeration system uses a miniature reciprocating vapor compression compressor system. Due to space limitations in some high-performance computer servers, a miniature refrigeration system composed of a compressor; capillary tube, compact systems are used. In addition, reliability, availability, and serviceability discussion of the proposed CPU-cooling refrigeration solution is presented. The results show that the new technology not only overcomes many shortcomings of the traditional fan-cooled systems but also has the capacity of increasing the cooling system's coefficient of performance COP. Keyword: - VCR, Compressor, Evaporator, Refrigerant etc. 1. INTRODUCTION As the number of transistors in integrated circuits has rapidly increased to provide greater functionality and computational power, removing the heat dissipated from electronic chips has become a serious challenge in the design of portable device and other space-limited electronics systems. According to the International Technology Roadmap for Semiconductors 2003, the heat dissipation from a single chip package will rise to 170 W in 2005 for high-performance systems. The maximum junction temperature, meanwhile, must continue to be maintained at or below 85 0C. Conventional air cooling techniques are no longer expected to meet the required heat dissipation needs. These methods include heat pipes, liquid immersion, jet impingement and sprays, thermoelectric, and refrigeration. The available alternatives, refrigeration is one of the only methods which can work in high- temperature ambient, and even result in negative values of thermal resistance. The advantages of refrigeration cooling include maintenance of low junction temperatures while dissipating high heat fluxes, potential increases in microprocessor performance at lower operating temperatures, and increased chip reliability. These advantages must be balanced against the increased complexity and cost increase in the cooling system, possible increases in cooling system volume, and uncertainties in the system reliability due, for instance, to moving parts in the compressor.[4]