Accepted Manuscript Enhanced adhesion of polypropylene to copper substrates Witold Brostow, I. Kang Chen, Nathalie Hnatchuk, Justin Hrbacek, Andrew Hull, Raymond H. Pahler, Ajay Srinivasan PII: S0142-9418(17)30211-8 DOI: 10.1016/j.polymertesting.2017.05.017 Reference: POTE 5023 To appear in: Polymer Testing Received Date: 22 February 2017 Revised Date: 4 April 2017 Accepted Date: 12 May 2017 Please cite this article as: W. Brostow, I.K. Chen, N. Hnatchuk, J. Hrbacek, A. Hull, R.H. Pahler, A. Srinivasan, Enhanced adhesion of polypropylene to copper substrates, Polymer Testing (2017), doi: 10.1016/j.polymertesting.2017.05.017. This is a PDF file of an unedited manuscript that has been accepted for publication. As a service to our customers we are providing this early version of the manuscript. The manuscript will undergo copyediting, typesetting, and review of the resulting proof before it is published in its final form. Please note that during the production process errors may be discovered which could affect the content, and all legal disclaimers that apply to the journal pertain.