Int. J. Nanomanufacturing, Vol. X, No. Y, XXXX 1 Copyright © XXXX Inderscience Enterprises Ltd. 2D and 3D growth of carbon nanotubes on substrates, from nanometre to millimetre scales A. John Hart* Department of Mechanical Engineering, University of Michigan. Ann Arbor, MI, USA E-mail: ajohnh@umich.edu *Corresponding author Hayden K. Taylor Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Cambridge, MA, USA E-mail: hkt@mit.edu Alexander H. Slocum Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA E-mail: slocum@mit.edu Abstract: This paper presents a suite of techniques for making Carbon Nanotube (CNT) assemblies having hierarchical two- and three-dimensional organisation: conformal films of tangled single-walled CNTs are grown on silicon microstructures, millimetre-thick films and microstructures of aligned Multi-wall CNTs (MWNTs) are grown on flat silicon substrates, large-area CNT micropatterns are fabricated by post-growth dry embossing of aligned CNT films and 3D forms of CNTs are directly grown to take the shape of microfabricated template. These growth processes use catalyst thin-films deposited by electron beam evaporation and atmospheric-pressure thermal Chemical Vapour Deposition (CVD), which is scalable from academic-level prototyping to industrial-level manufacturing. Keywords: Carbon Nanotubes; CNTs; nanostructures; growth; Chemical Vapour Deposition; CVD; embossing; microfabrication; patterning; microstructures; moulding. Reference to this paper should be made as follows: Hart, A.J., Taylor, H.K. and Slocum, A.H. (XXXX) ‘2D and 3D growth of carbon nanotubes on substrates, from nanometre to millimetre scales’, Int. J. Nanomanufacturing, Vol. X, No. Y, pp.XXX–XXX. Biographical notes: A. John Hart is an Assistant Professor of Mechanical Engineering at the University of Michigan in Ann Arbor, Michigan. He received his PhD in 2006 and SM in 2002 from the Massachusetts Institute of Technology and a BSE in 2000 from the University of Michigan, all in