INSTITUTE OF PHYSICS PUBLISHING NANOTECHNOLOGY
Nanotechnology 15 (2004) 158–162 PII: S0957-4484(04)70446-8
Direct writing of ZrO
2
on a sub-10 nm
scale using an electron beam
K R V Subramanian
1
, M S M Saifullah
1,3
, E Tapley
2
,
Dae-Joon Kang
1
, M E Welland
1
and M Butler
2
1
The Nanoscience Centre, Interdisciplinary Research Collaboration in Nanotechnology,
University of Cambridge, 11 J J Thomson Avenue, Cambridge CB3 0FF, UK
2
Leica Microsystems Lithography Limited, PO Box 87, Coldhams Lane,
Cambridge CB1 3XE, UK
E-mail: msms2@eng.cam.ac.uk
Received 14 October 2003, in final form 28 October 2003
Published 14 November 2003
Online at stacks.iop.org/Nano/15/158 (DOI: 10.1088/0957-4484/15/1/031)
Abstract
We describe a direct write technique using an electron beam to pattern ZrO
2
on a sub-10 nm scale that bypasses the conventional method of sputtering
and lift-off. This technique utilizes spin-coatable ZrO
2
resist prepared by
chemically reacting zirconium n-butoxide with benzoyl acetone in ethanol.
The patterned resist has a sensitivity and contrast of ∼40 mC cm
-2
and 3,
respectively. Baking the resist at 85
◦
C increases the sensitivity to
∼9 mC cm
-2
. The electron-beam-exposed regions become insoluble in
acetone, thus yielding negative patterns. This property was exploited to
write high-resolution patterns as small as 9 nm wide. Such negative patterns
can be written with a pitch as close as 30 nm.
1. Introduction
Zirconium dioxide offers advantages of high strength, fracture
toughness, wear resistance, high refractive index, low loss
in visible and near infrared region [1], heat resistance,
chemical inertness, relatively high dielectric constant [2]
and oxygen ion conductivity [3]. These properties are
used to manufacture oxygen sensors [3], fuel cells [4],
optical filters, laser mirrors [5], alternative gate dielectrics
in microelectronics [6] and membranes for high-temperature
oxygen permeation [7]. The potential for miniaturization of
some of these devices is offset by the fact that conventional
methods of patterning ZrO
2
using the lift-off technique remain
unreliable. The lift-off process is almost always unsuccessful
especially when complicated features and thick films of ZrO
2
are desired. In order to overcome this problem, we propose
direct writing of ZrO
2
using an electron-beam-sensitive spin-
coatable ZrO
2
resist. This resist is capable of direct writing
on a sub-10 nm resolution. Spin-coatable ZrO
2
resist was
prepared by reacting zirconium n-butoxide, Zr(OBu
n
)
4
, with
benzoylacetone, BzAc. The resist was found to be stable in air.
Electron beam patterning resulted in 9 nm wide lines. Features
as small as 10 nm could be patterned on a 30 nm pitch.
3
Author to whom any correspondence should be addressed.
2. Experimental details
The desired characteristics in an electron beam resist are
good chemical stability and developmental characteristics.
In order to optimize the chemical stability of the resist
in solution, Zr(OBu
n
)
4
(zirconium n-butoxide, 80 wt%
solution in 1-butanol, Sigma Aldrich) was reacted with
various β -diketones (acetyl acetone and BzAc) and β -
ketoesters (methyl acetoacetate, ethyl acetoacetate, isopropyl
acetoacetate, isobutyl acetoacetate and isoamyl acetoacetate)
in equimolar amounts for 2 h at room temperature inside
a glove box (<5% relative humidity). The solvent was
ethanol. The solutions were observed for precipitation. It was
seen that all β -diketone and β -ketoester-stabilized Zr (OBu
n
)
4
gave clear solutions but poor developmental characteristics
except for BzAc-stabilized Zr (OBu
n
)
4
. The BzAc-stabilized
Zr(OBu
n
)
4
gave a clear solution and developed easily in
acetone. As a result, only this combination was chosen for
further experimental studies.
BzAc-stabilized Zr (OBu
n
)
4
solution was diluted in
1-pentanol and spin-coated on pre-cleaned SiO
2
/Si wafers.
Resist thickness was measured using an EL X-02 C DRE
GmbH ellipsometer. One set of coated wafers was baked
at 85
◦
C for an hour. The exposure characteristics of the
resists were studied using a modified JEOL 4000EX nanowriter
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