K. Pavan Kumar et al Int. Journal of Engineering Research and Applications www.ijera.com ISSN : 2248-9622, Vol. 3, Issue 6, Nov-Dec 2013, pp.1054-1057 www.ijera.com 1054 | Page s=0 s=1 s=2 Thermal and Structural Analysis of Tree Shaped Fin Array K. Pavan Kumar * , P.V.Vinay * , R.Siddhardha * * (Department of Mechanical Engineering, GVP College for Degree and PG Courses (Technical campus), Rushikonda, Visakhapatnam-45) ABSTRACT The effective heat disbursal from surfaces using fins of various shapes and sizes has been a constant research interest. In the field of electronics, increasing the heat dissipation capacity of the fins used has been a continuous challenge for engineers. With the evolution of various structures and materials for the manufacture of fins has provided impetus to the research and experimentation. The present paper discusses the possibility of using a variant of tree fin array as a heat sink for a processor in a computer terminal. An array of Tree fins with and without slots were modelled and tested for different materials. By observing the structural deformation and temperature distribution the probable Tree fin and its material is suggested and discussed. Keywords: Heat sink, Tree fin, fin array, slotted fins I. INTRODUCTION With the advent of electronic age and the miniaturisation of mother boards and processors and the sudden spurt in their usage has intensified the search for the right kind of heat dissipation mechanisms from electronic chips. The heat transfer can be increased by the three different augmentation techniques such as Passive techniques, Active techniques and Compound techniques. The active heat transfer enhancement techniques have not found commercial interest because of the capital and operating cost of the enhancement devices. A compound technique involves complex design. The majority of passive techniques employ special surface geometry or fluid additives for enhancement. Passive techniques are the best augmented techniques. Extended surfaces are widely used passive techniques to enhance heat transfer. I. LITERATURE SURVEY The tree shaped flow paths are the most common and visible way of distribution in the engineering as well as the real world entity propagation. The tree shaped flow paths have been put in place on the principle of global optimisation of system performance subject to global constraints [1]. The system is the volume that is covered at every point by the volume-point flow. The objective of optimisation is the minimisation of overall resistance offered by the volume-point flow. The global constraints being, the fixed system volume and the fixed volume fraction occupied by the channels. Thermal performance and mass minimisation of extended surfaces was studied for rectangular, pin and triangular shaped arrays for effective heat dissipation from various surfaces by different convection models natural and forced[3,4,5,6,]. With the availability of various advanced materials and methodologies of transport and thermal media deposition, the landscape of heat dissipation has changed. A systematic theoretical investigation of the effects of fin spacing, fin height, fin length and temperature difference between fin and surroundings on the free convection heat transfer from horizontal fin arrays was carried out with a parametric study to ascertain optimum performance, this performance was analysed and shown that it cannot be obtained from one or two parameters[10]. Experimental investigations on pin-fin arrays subjected to forced convection environments to find the dependencies of nusselt number on Reynolds number yielded good results [11]. The effect of free convective heat transfer from fins and fin arrays attached to a heated horizontal base was experimentally studied [9]. The technique of differential interferometry has been utilised and experiments have been carried out under steady state conditions. Local values of heat flux, temperature, heat transfer coefficients, and local, overall Nusselt numbers have been estimated. The utilisation of tree shaped fins for effective heat dissipation in space environment was studied [7]. This paper discusses variations in a tree shaped fin and for various materials keeping volume constant. The usages of rectangular fins in the heat sink used for the processor were proved to be of lower heat conducting capability than the tree fins. II. DESIGN AND MODELLING (a) RESEARCH ARTICLE OPEN ACCESS