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10.1109/LPT.2015.2405611, IEEE Photonics Technology Letters
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Abstract— Germanium-on-silicon is a highly promising
platform for planar photonics for the mid-infrared, due to
germanium’s wide transparency range. In this paper we report
Ge-on-Si waveguides with record low losses of only 0.6dB/cm,
which is achieved by using a 2.9 μm thick germanium layer, thus
minimizing mode interaction with dislocations at the
germanium/silicon interface. Using these waveguides multimode
interferometers with insertion losses of only 0.21 ± 0.02 dB are also
demonstrated.
Index Terms—Mid-infrared, germanium, waveguides.
I. INTRODUCTION
HERE is a need for waveguide platforms that can be used
throughout the mid-infrared (MIR) wavelength range for a broad
range of sensing applications, which include environmental
monitoring, gas sensing, and toxic chemical detection for homeland
security. Planar photonics promises, through integration, to shrink the
cost and size of existing MIR sensing systems. In addition, there is
growing interest in using the 2-3 μm wavelength region to increase the
bandwidth available in future telecommunications systems [1]. Group-
IV materials are attractive for mid-infrared photonics because of their
wide transparency ranges, high refractive indexes, mechanical
robustness, and high nonlinear coefficients [2]. Silicon-on-insulator
(SOI) is the most popular near-infrared group-IV material platform,
but since silicon dioxide has high absorption throughout most of the
MIR, alternatives are required.
Recent years have brought rapid investigation of alternative material
platforms, including: silicon membrane (or suspended silicon) [3, 4],
silicon-on-sapphire [5-7], silicon on silicon nitride [8], and
germanium-on-silicon (Ge-on-Si). Ge-on-Si has by far the widest
transparency range because Ge has absorption <1 dB/cm from 2-15
μm [9], and while silicon’s high absorption for λ > 8µm prevents its
use as a waveguide core material, Ge-on-Si waveguides may have
acceptable losses all the way to 15 μm if the mode overlap with the
substrate is minimized. Ge-on-Si waveguides were first demonstrated
with losses of 2.5-3.0 dB/cm at λ=5.8 μm by Chang et.al [10]. Since
then Ge-on-Si multiplexers [11, 12], Mach-Zehnder interferometers
[13], and thermo-optic modulators [14] have also been investigated.
In this paper we present Ge-on-Si waveguides with greatly
improved propagation losses at the 3.8 μm wavelength, and we report
for the first time insertion losses of Ge-on-Si 1×2 and 2×2 multimode
interferometers (MMI), which are based on those waveguides. It
Submitted for review on 05/12/14. The authors acknowledge EPSRC for
financial support under the project MIGRATION (EP/L01162X/1). G. Z.
Mashanovich would like to acknowledge support from the Royal Society
through his University Research Fellowship.
should also be noted that grating couplers in Ge have been used for the
first time.
II. WAVEGUIDES
The waveguides were fabricated using commercially available 6”
Ge-on-Si wafers with a 3 μm Ge thickness. The Ge film was grown
on the Si substrate by reduced pressure chemical vapor deposition
(RPCVD). The resulting film exhibits a threading dislocation density
(TDD), arising from the lattice constant difference between Si and Ge,
of 2×10
7
- 5×10
7
cm
-2
,
which was determined using a wet selective
defect etch. In such an etch, the chemical reaction is sensitive to the
presence of defects, which therefore reveals the defects so that they are
observable using microscopy techniques (i.e. SEM or optical
microscopy) [15] .
Waveguide modelling was carried out using the FMM solver in the
Photon Design Fimmwave commercial software package [16]. Rib
waveguides were designed for single mode propagation at λ=3.8 μm,
with the dimensions waveguide height (H) = 2.9 μm, width (W) = 2.7
μm, and etch depth (D) = 1.7 μm. The simulated TE mode profile is
shown in fig. 1.
Fig. 1. Simulated TE mode profile at λ=3.8 μm, for a Ge-on-Si
waveguide with H = 2.9 μm, D = 1.7 μm, and W = 2.7 μm.
Waveguide patterns were defined on ZEP-520A positive
resist by e-beam lithography. The ZEP was deposited by
spinning at 1000rpm, with ellipsometer measurements
confirming that the resulting layer had a thickness of 710nm
and acceptable uniformity. Following lithography the sample
was dry etched in an Oxford Instruments ICP 380 plasma
system, using SF6
and C
4
F
8
gases, to transfer the pattern into the
Ge layer. The Ge:ZEP etch selectivity was 3.0:1, so no hard
mask was required. The ZEP e-beam resist was removed by
treatment in an O
2
plasma asher.
All authors are with the Optoelectronics Research Centre, University of
Southampton, Southampton, Hampshire, SO17 1BJ, United Kingdom. The
corresponding author is M. Nedeljkovic (e-mail: m.nedeljkovic@soton.ac.uk).
Copyright © 2015 IEEE.
Surface Grating Coupled Low Loss Ge-on-Si
Rib Waveguides and Multimode Interferometers
M. Nedeljkovic, J. Soler Penadés, C. J. Mitchell, A. Z. Khokhar, S. Stanković, T. Dominguez Bucio,
C. G. Littlejohns, F. Y. Gardes, and G. Z. Mashanovich
T