1. 2. 3. High aspect ratio through-wafer interconnections for 3D-microsystems Wang L., Nichelatti A., Schellevis H., De Boer C., Visser C., Nguyen T.N., Sarro P.M. Delft Univ. of Technology, DIMES, LECTM, P.O. Box 5053, 2600 GB Delft, Netherlands; Hanoi University of Technology, ITIMS, Hanoi, Viet Nam Abstract: Closely spaced, through-wafer interconnects are of large interest in RF MEMS and MEMS packaging. In this paper, a suitable technique to realize large arrays of small size through-wafer holes is presented. This approach is based on macroporous silicon formation in combination with wafer thinning. Very high aspect ratio (≥ 100) structures are realized. The wafers containing the large arrays of 2-3μm wide holes are thinned down to 200-150μm by lapping and polishing. Copper electroplating is finally employed to realize arrays of high aspect ratio Cu plugs. Index Keywords: Aspect ratio; Chemical vapor deposition; Copper; Dry etching; Electrochemistry; Electronics packaging; Electroplating; Ion implantation; Porous silicon; Reactive ion etching; Silicon nitride; Silicon wafers; High aspect ratio structure; Macroporous silicon; Wafer thinning; Microelectromechanical devices Year: 2003 Source title: Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS) Page : 634-637 Cited by: 21 Link: Scorpus Link Correspondence Address: Wang, L.; Delft Univ. of Technology, DIMES, LECTM, P.O. Box 5053, 2600 GB Delft, Netherlands; email: lwang@dimes.tudelft.nl Sponsors: IEEE;Robotics and Automation Society Conference name: IEEE Sixteenth Annual International Conference on Micro Electro Mechanical Systems Conference date: 19 January 2003 through 23 January 2003 Conference location: Kyoto Conference code: 61161 CODEN: PMEME Language of Original Document: English Abbreviated Source Title: Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS) Document Type: Conference Paper Source: Scopus Authors with affiliations: Wang, L., Delft Univ. of Technology, DIMES, LECTM, P.O. Box 5053, 2600 GB Delft, Netherlands Nichelatti, A., Delft Univ. of Technology, DIMES, LECTM, P.O. Box 5053, 2600 GB Delft, Netherlands Schellevis, H., Delft Univ. of Technology, DIMES, LECTM, P.O. Box 5053, 2600 GB Delft, Netherlands