IEEE TRANSACTIONS ON ELECTRON DEVICES, VOL. 56, NO. 6, JUNE 2009 1309
Analysis of the Bipolar Current Mirror Including
Electrothermal and Avalanche Effects
Niccolò Rinaldi, Member, IEEE, Vincenzo d’Alessandro, and Lis K. Nanver, Member, IEEE
Abstract—An experimental and numerical study of the bipolar
current mirror characteristics under strong self-heating and
avalanche conditions is presented, and a theoretical model to
describe the observed behavior is proposed. It is shown that both
electrothermal effects and impact ionization may lead to a marked
degradation of the mirroring action, eventually resulting in an
instability phenomenon which limits the usable operating range
of the circuit. Both the separate and combined actions of these
positive-feedback mechanisms are investigated. The model com-
pares favorably with experimental data measured on silicon-on-
glass and GaAs current mirrors and allows deriving a theoretical
relation for the critical condition corresponding to the onset of
the instability. The impact of the most significant technology and
design parameters is discussed, and design criteria are given in
order to ensure an unconditionally stable behavior.
Index Terms—Bipolar junction transistor (BJT), breakdown
voltage, current mirror, electrothermal simulation, heterojunction
bipolar transistor (HBT), impact ionization, thermal instability,
thermal resistance.
I. INTRODUCTION
D
EVICE scaling is leading the heterojunction bipolar tech-
nology in its restless march toward the terahertz band-
width operation range [1], [2]. However, it is known that scaling
rules have some adverse implications for reliability, as they tend
to enhance thermal effects as well as impact ionization. While
III–V heterojunction bipolar transistor (HBT) technologies are
already thermally limited [3], [4], self-heating is expected to
become more severe also in silicon bipolar junction transistors
(BJTs) and SiGe HBTs due to the following different evo-
lutionary trends: 1) the increase in collector current density
needed to support higher operating frequencies [5]; 2) the use
of advanced isolation schemes [e.g., oxide- [6] or even air-filled
trenches [7], and silicon-on-insulator (SOI) [8] and silicon-on-
glass (SOG) [9] processes]; 3) the decrease in parasitic resis-
tances, as needed to improve the intrinsic device speed, which
results in a diminished ballasting action with respect to the
electrothermal feedback [10]. Thermal effects not only degrade
device performance in terms of both functional operation and
long-term reliability [11] but can also cause instability effects
if certain critical conditions are reached, and this poses a limi-
Manuscript received November 6, 2008; revised February 27, 2009. First
published April 28, 2009; current version published May 20, 2009. The review
of this paper was arranged by Editor J. Cressler.
N. Rinaldi and V. d’Alessandro are with the Department of Electronics
and Telecommunications Engineering, University of Naples Federico II, 80125
Naples, Italy (e-mail: vindales@unina.it).
L. K. Nanver is with the Laboratory of Electronic Components, Technology,
and Materials, Delft Institute of Microsystems and Nanoelectronics, Delft
University of Technology, 2628 Delft, The Netherlands.
Digital Object Identifier 10.1109/TED.2009.2018171
tation in the usable operating range of the device [12], [13]. The
avalanche-related reliability issues imposed by scaling trends in
collector engineering are well known [14], [15], and they result
in an inherent tradeoff between operation speed and breakdown
voltage that is usually referred to as the “Johnson Limit” [16].
The limitations imposed on device operation by self-heating
and impact ionization are critically dependent on the conditions
under which the device is driven [12], [17]. It is well known that
the situation during avalanching under open-base conditions
is particularly precarious, since the holes generated by impact
ionization in the base-collector space-charge region cannot flow
out of the base node and are injected into the emitter, thereby
creating a positive-feedback mechanism. Under these condi-
tions, the device is limited by the open-base breakdown voltage
BV
CEO
. In practical circuit applications, the base is never
driven with an infinite impedance, and the maximum usable
dc output voltage is typically limited by the onset of impact-
ionization-induced instabilities to values ranging from BV
CEO
to the open-emitter breakdown voltage BV
CBO
, depending on
the driving conditions [17]–[19]. Because of the reduction of
the usable operating range imposed by scaling trends, it is of
primary importance for the designer to have a clear picture
of the actual limits on circuit operation, particularly in appli-
cations such as output stages or bias circuits where operation
above BV
CEO
is required [20]–[22]. Only then, it is possible to
fully exploit the performance potentials of a given technology.
In past work, the influences of thermal effects and impact
ionization on the usable operating range of the current mirror
were studied separately. A few papers have been published,
which investigate thermal issues in current mirrors fabricated
in bipolar technology [23]–[27]. These works showed that the
electrothermal feedback acting on the output transistor may
lead to significant mirror ratio (MR) degradation. In [28],
the current mirror scheme is adopted as a test structure for
estimating the impact of electrothermal issues in SOI BJTs
and for characterizing the thermally limited safe operating area
(SOA). The influence of avalanching on the characteristics of
current mirrors was investigated by Veenstra et al. [20]. In this
work, it is demonstrated that current mirrors can safely operate
at voltages above BV
CEO
, up to a breakdown voltage BV
CED
,
the value of which depends only on the emitter area ratio of the
devices. Furthermore, new topologies for bias current circuits
are proposed in [20] to extend the operation range to higher
voltage values. In a more recent paper [29], a semiempirical
approach is used to estimate the overall SOA including thermal
and avalanche effects, as well as hot carrier-induced degrada-
tion. However, none of these works offer a complete theoretical
treatment elucidating all relevant complex mechanisms such as
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