See discussions, stats, and author profiles for this publication at: https://www.researchgate.net/publication/252175180 Correlation between intermetallic thickness and roughness during solder reflow ARTICLE in JOURNAL OF ELECTRONIC MATERIALS · AUGUST 2001 Impact Factor: 1.8 · DOI: 10.1007/BF02657724 CITATIONS 6 READS 13 4 AUTHORS, INCLUDING: Zuruzi Abu Samah Institut Teknologi Brunei 31 PUBLICATIONS 358 CITATIONS SEE PROFILE Prabir Burman University of California, Davis 49 PUBLICATIONS 840 CITATIONS SEE PROFILE Kim S Siow National University of Malaysia 20 PUBLICATIONS 619 CITATIONS SEE PROFILE Available from: Kim S Siow Retrieved on: 13 January 2016