             !"                         ! " " #$ !  % &  ’() # #  *  +’’ ,  *   ’(+ # -& *  ! . /’ # 011 011 011 0 20 #$% 3!  %14   5  SiC MOSFETs have very large interface trap densities which degrade device performance. The effect of traps on inversion layer mobility and inversion charge concentration has been studied, and mobility models suitable for inclusion in Drift!Diffusion simulators have been developed for steady state operation of SiC MOSFET devices. Here, we attempt to model the transient behavior of SiC MOSFETs, and at the same time, extract the time constants for the filling and emptying of interface traps. As compared to the inversion layer, interface traps in SiC MOSFETs are slow in reacting to change in gate bias. So, at the positive edge of a gate pulse, we see a large current in the MOSFET, which then decays slowly to the steady state value as the interface traps fill up. We have developed a generation/recombination model for minority carriers in a SiC MOSFET based on the Shockley!Read!Hall recombination model for electrons and holes. In our model, the generation/recombination takes place between minority carriers in the inversion layer, and the traps at the SiC!SiO 2 interface. Comparing our simulated current vs. time curves to experiment, we have been able to extract time constants for the filling and emptying of traps at the SiC!SiO 2 interface.  In steady state operation of SiC MOSFETs, occupied interface traps cause mobility degradation and reduction in mobile charge in the inversion layer, thereby lowering current and degrading device performance [1!4]. In MOSFET switching applications, the rate at which the interface traps can be filled and emptied will affect the transient response of the device and also pose stability concerns. Here, we describe how we characterize the transient behavior of SiC MOSFETs, and discuss how to extract time constants for the filling/emptying of interface traps. Our method combines measurements with detailed numerical device modeling. We introduce a generation!recombination model for carriers in the semiconductor that can occupy the interface traps, and thereby obtain a time dependent trap occupation model. These are incorporated in our drift diffusion simulator for SiC MOSFETs [5]. Simulated transient characteristics are compared with experiment to extract trap physics.       The occupation of traps at the interface of a SiC MOSFET can be thought of as recombination of a mobile carrier in the semiconductor with an empty trap state at the interface. Similarly, emission of an electron from a trap will cause a generation event in the semiconductor. Thus, this generation! recombination process is a single carrier process. In the case of filling/emptying of the interface traps, there is a net shift in charge from the semiconductor to the interface, or vice!versa. An initial net non!zero generation!recombination rate takes a finite time to become zero and reach steady state, giving a constant occupied trap density and mobile charge concentration. Materials Science Forum Vols. 556-557 (2007) pp 847-850 online at http://www.scientific.net © (2007) Trans Tech Publications, Switzerland Online available since 2007/Sep/15 All rights reserved. No part of contents of this paper may be reproduced or transmitted in any form or by any means without the written permission of the publisher: Trans Tech Publications Ltd, Switzerland, www.ttp.net. (ID: 72.66.90.198-15/06/09,21:50:07)