Graphene Synthesis on Cubic SiC/Si Wafers.
Perspectives for Mass Production of
Graphene-Based Electronic Devices
Victor Yu. Aristov,*
,†,‡
Grzegorz Urbanik,
†
Kurt Kummer,
§
Denis V. Vyalikh,
§
Olga V. Molodtsova,
†
Alexei B. Preobrajenski,
|
Alexei A. Zakharov,
|
Christian Hess,
†
Torben Ha ¨nke,
†
Bernd Bu ¨ chner,
†
Ivana Vobornik,
⊥
Jun Fujii,
⊥
Giancarlo Panaccione,
⊥
Yuri A. Ossipyan,
‡
and Martin Knupfer
†
†
Leibniz Institute for Solid State and Materials Research, D-01069 Dresden, Germany,
‡
Institute of Solid State
Physics, Russian Academy of Sciences, Chernogolovka, Moscow District, 142432, Russia,
§
Institute of Solid State
Physics, Dresden University of Technology, D-01062 Dresden, Germany,
|
MAX-lab, Lund University, Box 118,
22100 Lund, Sweden, and
⊥
TASC National Laboratory, INFM-CNR, SS 14, km 163.5, I-34012 Trieste, Italy
ABSTRACT The outstanding properties of graphene, a single graphite layer, render it a top candidate for substituting silicon in future
electronic devices. The so far exploited synthesis approaches, however, require conditions typically achieved in specialized laboratories
and result in graphene sheets whose electronic properties are often altered by interactions with substrate materials. The development
of graphene-based technologies requires an economical fabrication method compatible with mass production. Here we demonstrate
for the fist time the feasibility of graphene synthesis on commercially available cubic SiC/Si substrates of >300 mm in diameter,
which result in graphene flakes electronically decoupled from the substrate. After optimization of the preparation procedure, the
proposed synthesis method can represent a further big step toward graphene-based electronic technologies.
KEYWORDS Graphene layer, synthesis, cubic SiC surface
G
raphene possesses astonishing electronic properties,
1,2
like the exceedingly high charge carrier mobility and
the occurrence of Dirac fermions.
3-6
The unique elec-
tronic properties of graphene make this material an interesting
one for potential applications in electronic devices.
7-9
His-
torically the first method of graphene fabrication involved
handmade processes such as mechanical exfoliation
1,10
and
was not practical. Other methods are based on graphene
films grown on different substrates.
The self-organized growth of carbon atoms into the
graphene structure is highly favored on substrates with
comparable lattice structure. This was demonstrated for
instance for graphene grown on the Ni(111) or Ir(111)
surfaces
11
and for graphene on the hexagonal 6H- and 4C-
SiC(0001) (R-SiC) surfaces.
12-14
The preparation of graphene
layers by the thermal decomposition of R-SiC has been
proposed as a promising method for the synthesis of homo-
geneous, wafer-size graphene layers for technological ap-
plications. The method has considerable advantage due to
the fact that R-SiC is a large gap semiconductor, which serves
as a substrate for the graphene layer.
The substrate considered in this paper, cubic 3C-SiC (-
SiC) is readily grown in large size (>300 mm in diameter)
commercially available Si wafers.
15-17
Apparently, due to
its cubic lattice, -SiC does not appear suitable for graphene
growth. Contrary to common belief, we succeeded in grow-
ing high-quality graphene on cubic -SiC and found that the
interaction with the substrate is almost negligible, rendering
this system a perfect candidate for future graphene-based
electronics.
Bulk -SiC has zinc blende (sphalerite) structure, i.e., its
lattice is composed of two face-centered sublattices shifted
with respect to the other in the direction of the cube’s
diagonal by one-quarter of the diagonal length. Since one
sublattice contains silicon atoms and the other carbon
atoms, the crystal can be considered as composed of mona-
tomic Si and C planes alternating in the [001] direction.
Consequently the (001) surface is either silicon or carbon
terminated.
We exposed our sample with a Si-rich surface to a series
of annealing cycles with increasing temperature from 1200
K up to 1550 K. Over this process, all known SiC(001)
surface reconstructions
18-20
were observed in the low-
energy electron diffraction (LEED) patterns.
We show in Figure 1a the C 1s photoemission (PE) spectra
taken at hν ) 400 eV photon energy from the Si-rich
-SiC(001) 3 × 2 surface, the C-terminated -SiC(001) c(2 ×
2) surface and the C-rich -SiC(001) 1 × 1 surface.
In the case of the Si-rich surface, all carbon atoms occupy
equivalent bulk sites. Hence only one component at 282.9
eV binding energy (BE) is present in the PE spectra. Surface
* To whom correspondence should be addressed: e-mail, V.Aristov@
ifw-dresden.de; phone, +493514659548.
Received for review: 12/12/2009
Published on Web: 00/00/0000
pubs.acs.org/NanoLett
© XXXX American Chemical Society A DOI: 10.1021/nl904115h | Nano Lett. XXXX, xxx, 000–000