Layer Manufacturing as a Generic Tool for Microsystem Integration Per Johander 1 , Sjoerd Haasl 2 , Katrin Persson 2 and Urban Harrysson 3 1 IVF- Industrial Research and Development Corporation; Argongatan 30, SE-431 53 Mölndal, Sweden, 2 IMEGO AB; Arvid Hedvalls Backe 4, SE-411 33 Göteborg, Sweden; 3 FCubic AB; Källarlyckevägen 6, SE-429 35 Kullavik, Sweden Abstract Nearly every microsystem application requires specific packaging solutions. In this paper we suggest a new approach to use layer manufacturing as a generic tool for microsystem integration. Three different methods to produce 3D electrical interconnects are presented. Ink jet printing is used for the ceramic layer manufacturing process, as well as for the printing of silver for circuit patterns. The technique is demonstrated for an Inertial Measurement Unit(IMU) platform. A four-sided pyramid was manufactured with layer manufacturing in ceramics and four gyroscopes were mounted on the sides of the pyramid. A demonstrator with three light diodes was also manufactured to demonstrate the possibility to produce 3D electrical interconnects in the volume of the pyramid. Keywords: Layer Manufacturing, Microsystem 3D Electrical Interconnect, Micros system packaging 1. Introduction A microsystem is defined as a miniaturised system combining functions such as intelligence, sensing, processing and actuation. A microsystem is normally realised by combining two or more electrical, mechanical, optical or other functions on a single integrated chip or on a hybrid module incorporating several components. The cost for packaging is typically 40-60 % of the total cost for a microsystem but could be up to 90 %. It is therefore very important to find new cost-effective packaging concepts. The integration of the microsystem into a product usually restricts the shape and volume of the microsystem. Since the application variations are very large, it is very difficult to use standardised packaging concepts [1]. The approach we adopted to solve this problem was to use generic manufacturing concepts for both the mechanical and electrical integration. Our selection fell on layer manufacturing with focus on direct manufacturing. The advantages with direct manufacturing are that it does not need any special tools. The full geometric and functional information of the product is contained in a digital model, which is transferred to the production equipment. With layer manufacturing it is possible to manufacture very complex parts. It is therefore possible to manufacture packaging solutions for each specific application, making layer manufacturing a generic tool for microsystem integration. The following section provides a short overview of 3D direct manufacturing technologies. 1.1 3 D direct manufacturing. There are various principles for free-form or 3D direct manufacturing. In principle, all methods are based on a sliced CAD model of the part that contains the structural information of each layer. 1.1 Stereo Lithography A light-sensitive monomers are polymerised by a laser beam or through a photo-mask. The 3D structure is built up layer by layer and the final part is developed by chemically dissolving non-polymerised material. Ceramics parts can be built by adding monomers to a ceramic slurry. 1.3 Layer Manufacturing Techniques Laminated Object Manufacturing (LOM ) use ceramic tapes to build up the parts. The individual layers are manufactured by tape casting. The tapes can be structured with the help of lasers, water jets, etc. After layering the tapes to form the required shape, organic additives must be burnt off before the component can be sintered. 1.4 Shape Deposition Manufacturing (SDM) Is also characterised by a layered build-up. In this process, prototypes are manufactured from a blend of ceramic powders and organic thermoplastics or waxes, and the compound formed is then extruded layer by layer through a nozzle. The plastic body chills after leaving the nozzle and solidifies. To form the structure, the feed nozzle or the support table is moved in the X, Y and Z directions. 1.5 Laser Assisted Sintering (LAS), The structural information in the individual layers is formed with a laser. With the input of energy from the laser beam, the ceramic powder particles are bound to each other by melting or polymerisation of a polymer or by melting of a metal. The un- reacted material acts as support material and is cleaned off in the final stage. 1.6 Ink Jet Assisted Layer Manufacturing. The process used in this paper is based on a thin layer of ceramic powder is sliced out. The structural information in each layer is transferred by inkjet printing. The ink binds the ceramic powder particles together. The regions of the ceramic powder bed that are not printed with ink act as a