Silicon Monomer Formation and Surface Patterning of Si(001)2 × 1 Following Tetraethoxysilane Dissociative Adsorption at Room Temperature He ́ loise Tissot, ,,§ Jean-Jacques Gallet,* ,,,§ Fabrice Bournel, ,,§ Ahmed Naitabdi, ,,§ Debora Pierucci, ,,§ Federica Bondino, Elena Magnano, Franc ̧ ois Rochet, ,,§ and Fabio Finocchi , Laboratoire de Chimie Physique Matie ̀ re et Rayonnement, Sorbonne Universite ́ s, UPMC Univ Paris 06, UMR 7614, 11 rue Pierre et Marie Curie, 75231 Paris Cedex 05, France CNRS, UMR 7614, LCPMR, 75005 Paris, France § Synchrotron SOLEIL, LOrme des Merisiers, Saint-Aubin, Gif-sur-Yvette, France IOM-CNR, TASC Laboratory, s.s. 14 km 163.5, Basovizza, 34149 Trieste, Italy Institut des Nano-Sciences de Paris, Sorbonne Universite ́ s, UPMC Univ Paris 06, UMR 7588, 4 place Jussieu, 75252 Paris Cedex 05, France CNRS, UMR 7588, INSP, 75005 Paris, France * S Supporting Information ABSTRACT: The adsorption of tetraethoxysilane (TEOS, Si[OC 2 H 5 ] 4 ) on the Si(001)-2 × 1 surface at 300 K is studied through a joint experimental and theoretical approach, combining scanning tunneling microscopy (STM) and synchrotron radiation X-ray photoelectron spectroscopy (XPS) with rst-principles simulations within the density functional theory (DFT). XPS shows that all SiO bonds within the TEOS molecules are broken upon adsorption, releasing one Si atom per dissociated molecule, while the ethoxy (OC 2 H 5 ) groups form new SiO bonds with surface Si dimers. A comparison between experimental STM images and DFT adsorption congurations shows that the four ethoxy groups bind to two second-neighbor silicon dimers within the same row, while the released silicon atom is captured as a monomer on an adjacent silicon dimer row. Additionally, the surface displays alternate ethoxy- and Si adatom-covered rows as TEOS coverage increases. This patterning, which spontaneously forms upon TEOS adsorption, can be used as a template for the nanofabrication of one-dimensional self-organized structures on Si(001)-2 × 1. INTRODUCTION Since the beginning of the silicon surface chemistry studies in the mid-1980s, 1 the grafting of organic monomolecular arrays on silicon surfaces via the direct formation of SiC bonds (both in ultrahigh vacuum and wet conditions 2,3 ) has stimulated a considerable interest, essentially because of promising applications in molecular electronics. 4,5 Organo- silanes (by denition a silane that contains at least one SiC bond) are also widely used to form self-assembled monolayers on silicon substrates. 68 Within this class of molecules, alkoxysilanes (R n Si(OR) 4n ) are not attached directly to clean silicon surfaces, but rather to native silicon oxide ones, either through the direct reaction of surface SiOH with the hydrolyzable (alkoxy) terminations of the molecules or via a more complex process involving the participation of molecular water. Recently, Fan and Lopinski 9 investigated the reaction of an alkoxysilane, in the absence of molecular water, with the surface hydroxyls of the water-reacted surface (H,OH)-Si(001)- 2 × 1. 10 However, the grafting of alkoxysilanes directly on clean Si(001)-2 × 1 is an emerging eld of study. Recently, we examined the reaction of n-propyl-triethoxy-silane (PTES, Si[OCH 2 CH 3 ] 3 [CH 2 CH 2 CH 3 ]) on Si(001)-2 × 1 at room temperature and under ultrahigh vacuum conditions. 11 Using X-ray Photoemission Spectroscopy (XPS), we observed that PTES adsorbs dissociatively at room temperature via the scission of SiO bonds. However, the actual number of broken SiO bonds in PTES after dissociative adsorption remained elusive due to the presence of nonidentical ligands (one propyl and three ethoxy groups). 11 The latter issue prompted us to examine how a simpler molecule with four identical ligands, tetraethoxysilane (TEOS, Si[OCH 2 CH 3 ] 4 ), reacts with Si(001)-2 × 1. Many unknowns remain about the microscopic processes governing the adsorption of TEOS on Si(001)-2 × 1 at room temperature and under UHV conditions (see, e.g., the review by Rauscher 12 ). In fact most studies focus on the deposition and electrical/structural characterization of SiO 2 lms using TEOS Received: July 25, 2013 Revised: December 20, 2013 Published: December 30, 2013 Article pubs.acs.org/JPCC © 2013 American Chemical Society 1887 dx.doi.org/10.1021/jp407411k | J. Phys. Chem. C 2014, 118, 18871893