IJSRSET1622416 | Received : 01 May 2016 | Accepted : 05 May 2016 | March-April 2016 [(2)2: 1267-1277] © 2016 IJSRSET | Volume 2 | Issue 2 | Print ISSN : 2395-1990 | Online ISSN : 2394-4099 Themed Section: Engineering and Technology 1267 Effect of Alloying Elements on Electrochemical Corrosion Behavior, Microstructure, Wettability and Thermal Performance of Bismuth-Tin Based Alloys Abu Bakr El-Bediwi 1 , S. Bader 1 , Fathia Khalifa 1, 2 1 Metal Physics Lab., Physics Department, Faculty of Science, Mansoura University, Egypt 1, 2 Sirte University, Sirte, Libya ABSTRACT Microstructure, wettability behavior, corrosion parameters, thermal properties of quaternary bismuth- tin based alloy have been investigated using different experimental techniques. Induced lattice microstrain of Bi 60 Sn 40 alloy increased after adding Sb-Zn or Sb-Ag or Al-Cd or Al-Cu. Contact angle of Bi 60 Sn 40 alloy increased after adding Sb-Zn or Sb-Ag or Al-Cd or Al-Cu. A significant change (28%) occurred in contact angle of Bi 60 Sn 40 alloy after adding Al-Cd. Corrosion rate of Bi 60 Sn 40 alloy decreased after adding Sb-Zn or Sb-Ag but it increased after adding Al-Cd or Al-Cu. The melting temperature of Bi 60 Sn 40 alloy varied after adding alloying elements. The Bi 50 Sn 40 Al 5 Cd 5 alloy has the lowest melting temperature. Some properties of Bi 60 Sn 40 alloy improved after adding Sb-Zn or Sb-Ag elements which make them useful for different industrial applications. Keywords: Corrosion Behavior, Wettability, Microstructure, Melting Point, Thermal Performance, Pasty Range, Bismuth-Tin Alloys I. INTRODUCTION Bismuth is used in alloys to lower the melting point as in industry applications such as thermal switches. Much research was done for studying microstructure, electrical, mechanical and thermal properties of bismuth- lead/ bismuth-tin eutectic alloys, bismuth- lead- tin, bismuth- lead- tin- cadmium, tin- antimony with other elements additions [1-11]. The microstructure and microhardness of rapidly solidified foils of the Sn-58 wt. % Bi alloy was studied [12]. The Sn-Bi eutectic alloy nanoparticle consisted of the tetragonal phase of tin and the rehombohedral phase of bismuth [13]. The Bi-Sn eutectic alloy has a good soldering property such as low melting point, mechanical properties, adequate wettability and cost [14]. Splat quenching caused a metastable shift of the solubility limit in Sn-Bi alloys containing 15, 20 and 25 % bismuth [15]. The ductility of the binary Bi-Sn eutectic solders has significantly improved by adding small amount of Ag [16]. The phase formation during rapid solidification of the undercooled droplets Bi-Sn system at ambient pressure and of the thermal behavior of droplet samples under hydrostatic pressure conditions in an attempt to identify the structure and the operative solidification kinetics were studied [17]. The microstructural development of eutectic alloys Bi-Sn and In-Sn during high temperature deformation was studied and reported [18]. The aim of our research was to study the effect of quaternary alloying elements on microstructure, electrochemical corrosion behavior and soldering properties of bismuth- tin alloy. II. METHODS AND MATERIAL High purity (more than 99.5 %) bismuth, tin, antimony, zinc, silver, aluminum, cadmium and copper were melted in a muffle furnace to use in the production ingots from Bi 60 Sn 40 , Bi 50 Sn 40 Sb 7 Zn 3 , Bi 50 Sn 40 Sb 7 Ag 3 , Bi 50 Sn 40 Al 5 Cd 5 and Bi 50 Sn 40 Al 8 Cu 2 alloys. The resulting ingots were turned and re-melted four times to increase the homogeneity. Long ribbons of  3 mm width and