Thin Solid Films, 75 (1981) 29-36
PREPARATIONAND CHARACTERIZATION 29
NUCLEATION AND INTERFACE FORMATION IN THIN FILMS
G. S. A. SHAWKI, M. G. EL-SHERBINY AND F. B. SALEM
Department of Mechanical Design and Production, Faculty of Engineering, Cairo University, Cairo
(Egypt)
(Received May 22, 1980;acceptedJuly 7, 1980)
In this paper we present the results of an experimental investigation into the
nucleation and growth of ion-plated films. Transmission electron microscopy was
used to study the nucleation of ultrathin silver films (10-400 A thick) deposited on
carbon films about 50 A thick.
Test results reveal that the formation of the ion-plated films is dominated either
by direct deposition onto previously implanted nuclei or by the formation of new
nuclei. The effect of ion implantation is to minimize the now well-known liquid-like
behaviour of the deposited films. Furthermore, continuous ion-plated films can be
produced with lower thicknesses than continuous films conventionally deposited in
a vacuum.
1. INTRODUCTION
The development of the ion-plating technique put an end to many problems
traditionally associated with thin surface films ~'2. The exceptionally strong
adherence of ion-plated films is the main reason for the present superiority of these
films over conventionally deposited coatings 2-4. Furthermore, this technique is now
finding a wide range of new potential applications in tribology and in corrosion
protection where conventional films have failed.
Although it is generally accepted that the physical properties of surface films are
dependent on their structures 5' 6, it nevertheless appears that available data on ion-
plated films are still quite limited 7' 8. Although a considerable amount of work on
nucleation, growth and microstructure has already been published for conven-
tionally deposited films6' 8, 9, very little is yet known of the microstructure of 1on-
plated films6' 1 o. Furthermore, these investigations of ion-plated films did not cover
film formation (nucleation and nuclei growth), in spite of the fact that the problem of
film-substrate adhesion is basically interfacial and is dominated by the mechanism
of nucleation s .
The present work is concerned with the role played by high energy particles in
the nucleation mechanism, which in turn influences film-substrate adhesion,
especially in the case of mutually incompatible materials.
Because of the high resolution needed for the study of such phenomena,
transmission electron microscopy is generally used 9. Unfortunately the ion-plating
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