http://www.iaeme.com/IJMET.asp 145 editor@iaeme.com International Journal of Mechanical Engineering and Technology (IJMET) Volume 6, Issue 11, Nov 2015, pp. 145-153, Article ID: IJMET_06_11_017 Available online at http://www.iaeme.com/IJMET/issues.asp?JType=IJMET&VType=6&IType=11 ISSN Print: 0976-6340 and ISSN Online: 0976-6359 © IAEME Publication THERMAL ANALYSIS OF A HEAT SINK FOR ELECTRONICS COOLING M. Chandra Sekhar Reddy Associate Professor, Department of Mechanical Engineering, UCE (A), Osmania University, Hyderabad – 500 007, India ABSTRACT Heat transfer is a discipline of thermal engineering that concern the generation, use, conversion and exchange of thermal energy, heat between physical systems. Heat transfer is classified in to various mechanisms such as heat conduction, convection, thermal radiation & transfer of energy by phase change. Most of the electronic equipment are low power and produce negligible amount of heat in their operation. Some devices, such as power transistors, CPU's, & power diodes produce a significant amount of heat. so sufficient measures are need to be taken so as to prolong their working life and reliability. Here, we deal with the design of a heat sink of Aluminum alloy for cooling of a PCB of dimension 233.3×160 with FPGA, fine pitch BGA package, which dissipates 19.5 watts of heat energy. The whole mode of heat transfer is carried out through forced convection with help of a cooling fan of specific velocity. Heat sinks are passive components that cool a device by dissipating heat into surrounding air. We need to introduce discontinuities in the fin surface to break up the boundary layer. This can be accomplished by cross cutting an extruded 'Al' heat sink to create a segmented fin. Heat sinks have a wide range of applications mainly in micro processors, BGA's, PCB's, Airplanes, Satellites, Space vehicles & missiles. Cite this Article: M. Chandra Sekhar Reddy. Thermal Analysis of A Heat Sink For Electronics Cooling, International Journal of Mechanical Engineering and Technology, 6(11), 2015, pp. 145-153. http://www.iaeme.com/currentissue.asp?JType=IJMET&VType=6&IType=11 1. INTRODUCTION Electronic devices are strategic devices such as radars, communication sets, and amplifiers, twt’s controls which are used in aircraft, space vehicles, missiles and ground stations. The use of these devices in strategic and military application is rapidly increasing and these equipments are becoming more and more sophisticated. They demand a great deal of mechanical design skill for achieving sound and reliable products. The equipments are liable at higher temperatures. Thermal design has become a crucial contribution in increasing the life of the equipment. There are many