ISSN 0976-5727 (Print) ISSN 2319-8133 (Online) Journal of Computer and Mathematical Sciences, Vol.6(5),228-251, May 2015 (An International Research Journal), www.compmath-journal.org May, 2015 | Journal of Computer and Mathematical Sciences | www.compmath-journal.org Modelling and Optimization of Shape of a Heat Sink Fins on Motherboard V. Mallikarjuna 1 , K. Rajesh 2 , K. Ramesh 3 and B. Rama Bhupal Reddy 4 1 Assistant Professor, Department of Mechanical Engineering, Joginapally B.R. Engineering College, Bhaskar Nagar, Yenkapally (V), Moinabad (M), RR Dist., INDIA. 2 Assistant Professor, Department of Mechanical Engineering, Mallareddy Engineering College, Maisammaguda, Kompally, Hydrabad, INDIA. 3 Assistant Professor, Department of Mechanical Engineering, Joginapally B.R. Engineering College, Bhaskar Nagar, Yenkapally (V), Moinabad (M), RR Dist., INDIA. 4 Head & Associate Professor, Dept. of Mathematics, K.S.R.M. College of Engineering (Autonomous), Kadapa, , A.P., INDIA. e-mail: reddybrb@gmail.com (Received on: May 1, 2015) ABSTRACT Due to rapid developments in the electronic industry, including a dramatic increase in chip densities and power densities, as well as a continuous decrease in physical dimensions of electronic packages, thermal management is, and will continue to be, one of the most critical areas in electronic product development. It will have a significant impact on the cost, overall design, reliability and performance. The present trend in electronic packing industry is to reduce the size and increase the performance of the equipment. The objective is to achieve high power densities. The cooling of the modern electronic component is one of the prime areas for the application of the thermal control techniques. In the present Paper, design of heat sinks for electronic components under different conditions is the prior criteria for a designer. So the design of the heat sink must mainly emphasize on the efficient heat transfer. In the present work effect of various shapes of cross sections of fins on the mother board is studied keeping the inlet air velocity, temperature of the ambient and the heat generation constant. The optimized shape of