This content has been downloaded from IOPscience. Please scroll down to see the full text. Download details: IP Address: 142.3.100.23 This content was downloaded on 23/08/2014 at 06:35 Please note that terms and conditions apply. A parylene-filled-trench technique for thermal isolation in silicon-based microdevices View the table of contents for this issue, or go to the journal homepage for more 2009 J. Micromech. Microeng. 19 035013 (http://iopscience.iop.org/0960-1317/19/3/035013) Home Search Collections Journals About Contact us My IOPscience