894 IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, VOL. 16, NO. 7, JULY 2008
Effective Radii of On-Chip Decoupling Capacitors
Mikhail Popovich, Member, IEEE, Michael Sotman, Avinoam Kolodny, Member, IEEE, and
Eby G. Friedman, Fellow, IEEE
Abstract—Decoupling capacitors are widely used to reduce
power supply noise. On-chip decoupling capacitors have tradition-
ally been allocated into the white space available on a die or placed
inside the rows in standard cell circuit blocks. The efficacy of
on-chip decoupling capacitors depends upon the impedance of the
power/ground lines connecting the capacitors to the current loads
and power supplies. A design methodology for placing on-chip
decoupling capacitors is presented in this paper. A maximum
effective radius is shown to exist for each on-chip decoupling
capacitor. Beyond this effective distance, a decoupling capacitor
is ineffective. Depending upon the parasitic impedance of the
power distribution system, the maximum voltage drop seen at the
current load is caused either by the first droop (determined by the
rise time) or by the second droop (determined by the transition
time). Two criteria to estimate the minimum required on-chip
decoupling capacitance are developed based on the critical para-
sitic impedance. In order to provide the required charge drawn
by the load, the decoupling capacitor has to be charged before
the next switching cycle. For an on-chip decoupling capacitor to
be effective, both effective radii criteria should be simultaneously
satisfied.
Index Terms—Decoupling capacitors, power distribution sys-
tems, power supply noise, signal integrity.
I. INTRODUCTION
T
HE feature size of integrated circuits (ICs) has been
aggressively reduced in the pursuit of improved speed,
power, and cost. The scaling of CMOS is expected to continue
for at least another decade. Future nanometer circuits will
soon contain more than a billion transistors and operate at
clock speeds well over 10 GHz [1]. Distributing robust and
reliable power and ground voltages in such a high speed, high
complexity environment is, therefore, a highly challenging task
[2].
Decoupling capacitors are widely used to manage power
supply noise. A decoupling capacitor acts as a reservoir of
charge, which is released when the power supply voltage at
Manuscript received January 23, 2007; revised March 23, 2007 and July 25,
2007. This research was supported in part by the Semiconductor Research Cor-
poration under Contract 2004-TJ-1207, by the National Science Foundation
under Contract CCR-0304574 and Contract CCF-0541206, by grants from the
New York State Office of Science, Technology and Academic Research to the
Center for Advanced Technology in Electronic Imaging Systems, and by grants
from Intel Corporation, Eastman Kodak Company, Intrinsix Corporation, and
Freescale Semiconductor Corporation.
M. Popovich is with CDMA Technologies, Qualcomm Corporation, San
Diego, CA 92121 USA (e-mail: mikhailp@qualcomm.com).
E. G. Friedman is with the Department of Electrical and Computer En-
gineering, University of Rochester, Rochester, NY 14627 USA (e-mail:
friedman@ece.rochester.edu).
M. Sotman and A. Kolodny are with the Department of Electrical Engi-
neering, Technion—Israel Institute of Technology, Haifa 32000, Israel (e-mail:
michael.sotman@intel.com; kolodny@ee.technion.ac.il).
Digital Object Identifier 10.1109/TVLSI.2008.2000454
Fig. 1. Placement of an on-chip decoupling capacitor based on the maximum
effective distance. To be effective, a decoupling capacitor should be placed close
to the current load during discharge. During the charging phase, however, the
decoupling capacitor should be placed close to the power supply to efficiently
restore the charge on the capacitor. The specific location of a decoupling ca-
pacitor should therefore be determined to simultaneously satisfy the maximum
effective distances during discharge and during charging.
a particular current load drops below some tolerable level.
Alternatively, decoupling capacitors are an effective way to
reduce the impedance of power delivery systems operating at
high frequencies [3]. The location of the decoupling capacitors
significantly affects the design of the power/ground (P/G)
network in high performance ICs such as microprocessors.
With increasing frequencies, a distributed hierarchical system
of decoupling capacitors placed on-chip is needed to effectively
manage the power supply noise [4].
The efficacy of decoupling capacitors depends upon the
impedance of the conductors connecting the capacitors to the
current loads and power sources. During discharge, the current
flowing from the decoupling capacitor to the current load results
in resistive noise ( drops) and inductive noise (
drops) due to the parasitic resistance and inductance of the
power delivery network. The resulting voltage drop across the
current load is therefore always greater than the voltage drop
at the decoupling capacitor. A maximum parasitic impedance
between the decoupling capacitor and the current load therefore
exists for which the decoupling capacitor is effective. To be
effective, a decoupling capacitor should therefore be placed
close to a current load during discharge (within the maximum
effective distance ), as shown in Fig. 1.
Once the switching event is completed, charge on the decou-
pling capacitor has to be restored before the next clock cycle
begins. During the charging phase, the voltage across the decou-
pling capacitor rises exponentially. The maximum frequency at
which the decoupling capacitor is effective is determined by the
parasitic resistance and inductance of the metal lines and the
size of the decoupling capacitor. A maximum effective distance
based on the charge time, therefore, exists for each on-chip de-
coupling capacitor. Beyond this effective distance, the decou-
pling capacitor is ineffective. Alternatively, to be effective, an
on-chip decoupling capacitor should be placed close to a power
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