Biosensors and Bioelectronics 25 (2010) 1889–1896
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Biosensors and Bioelectronics
journal homepage: www.elsevier.com/locate/bios
BioMEA
TM
: A versatile high-density 3D microelectrode array system using
integrated electronics
Guillaume Charvet
a
, Lionel Rousseau
b
, Olivier Billoint
a
, Sadok Gharbi
a
, Jean-Pierre Rostaing
a
,
Sébastien Joucla
e,f
, Michel Trevisiol
a
, Alain Bourgerette
a
, Philippe Chauvet
e,f
, Céline Moulin
a
,
Franc ¸ ois Goy
c
, Bruno Mercier
b
, Mikael Colin
d
, Serge Spirkovitch
d
, Hervé Fanet
a
,
Pierre Meyrand
e,f
, Régis Guillemaud
a
, Blaise Yvert
e,f,∗
a
CEA-LETI, Grenoble, France
b
ESIEE-Paris, Noisy-le-Grand, France
c
Bio-Logic SAS, Claix, France
d
Memscap, Crolles, France
e
CNRS, UMR5228, Bordeaux, F-33000, France
f
Université de Bordeaux, UMR5228, Bordeaux, F-33000, France
article info
Article history:
Received 24 June 2009
Received in revised form 13 October 2009
Accepted 5 January 2010
Available online 13 January 2010
Keywords:
Neural networks
Extracellular electrophysiological recording
Electrical microstimulation
ASIC
Implants
Neural prosthesis
abstract
Microelectrode arrays (MEAs) offer a powerful tool to both record activity and deliver electrical micros-
timulations to neural networks either in vitro or in vivo. Microelectronics microfabrication technologies
now allow building high-density MEAs containing several hundreds of microelectrodes. However, dense
arrays of 3D micro-needle electrodes, providing closer contact with the neural tissue than planar elec-
trodes, are not achievable using conventional isotropic etching processes. Moreover, increasing the
number of electrodes using conventional electronics is difficult to achieve into compact devices address-
ing all channels independently for simultaneous recording and stimulation. Here, we present a full
modular and versatile 256-channel MEA system based on integrated electronics. First, transparent high-
density arrays of 3D-shaped microelectrodes were realized by deep reactive ion etching techniques of
a silicon substrate reported on glass. This approach allowed achieving high electrode aspect ratios, and
different shapes of tip electrodes. Next, we developed a dedicated analog 64-channel Application Specific
Integrated Circuit (ASIC) including one amplification stage and one current generator per channel, and
analog output multiplexing. A full modular system, called BIOMEA
TM
, has been designed, allowing con-
necting different types of MEAs (64, 128, or 256 electrodes) to different numbers of ASICs for simultaneous
recording and/or stimulation on all channels. Finally, this system has been validated experimentally by
recording and electrically eliciting low-amplitude spontaneous rhythmic activity (both LFPs and spikes)
in the developing mouse CNS. The availability of high-density MEA systems with integrated electronics
will offer new possibilities for both in vitro and in vivo studies of large neural networks.
© 2010 Elsevier B.V. All rights reserved.
1. Introduction
Advances of microtechnologies in the past decades have opened
the way to massive recordings of large neural networks using
microelectrode arrays (MEAs). These approaches have been gaining
increasing interest in neuroscience because they provide an easy
way to probe neural activity distributed over multiple populations
of neurons either in vitro (Gross et al., 1982) or in vivo (Maynard
∗
Corresponding author at: CNRS and Université de Bordeaux, Centre Neuro-
sciences Intégratives et Cognitives, UMR 5228 Bâtiment B2, Avenue des facultés,
33405 Talence cedex, France. Tel.: +33 5 40 00 25 73; fax: +33 5 40 00 25 61.
E-mail address: b.yvert@cnic.u-bordeaux1.fr (B. Yvert).
et al., 1997; Nicolelis and Ribeiro, 2002; Buzsaki, 2004). MEAs have
thus found a wide variety of applications, including the exploration
of large-scale neuronal coding (Nicolelis et al., 1997), properties of
immature (Meister et al., 1991; Demas et al., 2003; Yvert et al.,
2007) or mature neural network activity (Beggs and Plenz, 2003),
activity-dependent adaptation and learning (Shahaf and Marom,
2001; Eytan et al., 2003; Wagenaar et al., 2005), and the devel-
opment of neural prosthesis (Klinke et al., 1999; Rauschecker and
Shannon, 2002; Weiland et al., 2005; Rizk et al., 2009) and brain-
machine interfaces (Chapin et al., 1999; Wessberg et al., 2000;
Taylor et al., 2002; Hochberg et al., 2006). These approaches make
use of arrays of metal microelectrodes contacting the neural tis-
sue and interconnected to a dedicated electronics ensuring signal
amplification, acquisition, and stimulation.
0956-5663/$ – see front matter © 2010 Elsevier B.V. All rights reserved.
doi:10.1016/j.bios.2010.01.001