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Cite this: Nanoscale, 2015, 7, 13373
Received 22nd May 2015,
Accepted 7th July 2015
DOI: 10.1039/c5nr03396a
www.rsc.org/nanoscale
Free-standing NiTi alloy nanowires fabricated by
nanoskiving†
Huilong Hou and Reginald F. Hamilton*
We report on free-standing NiTi alloy nanowires (120 nm × 75 nm)
fabricated using a technique referred to as “nanoskiving”, which
complements conventional thin film sputter deposition with ultra-
microtomy for thin sectioning. To date, the technique has been
limited to pure metals without exploring metallic alloys. Lever-
aging the technique for the fabrication of shape memory alloy
(SMA) nanostructures meets two critical requirements: compo-
sitional control (via film deposition) and controlled dimensions (via
film deposition and programmable sectioning). Microstructure and
composition analysis confirm continuity of the produced nano-
wires and Ni and Ti elemental uniformity. Free-standing NiTi nano-
wires are robust and remain intact throughout physical
manipulation. The fabrication of NiTi alloy nanowires by nano-
skiving will advance fundamental characterization of small scale
SMA behavior.
Nanoskiving combines thin film deposition and ultrathin sec-
tioning for the fabrication of free-standing nanowires, without
the need to access conventional lithography
4
and clean room
protocols,
4–7
and can be leveraged for fabricating shape
memory alloy (SMA) nanowires. NiTi SMAs are promising for
micro-/nano-scale actuation and sensing functionality, as they
offer the highest actuation density among active material
families,
8
high strength and ductility,
9
and good corrosion
resistance.
9
Conventional fabrication methods for semicon-
ductors and pure metals have been used for SMA nanowires
such as electrodeposition of Cu-based alloys,
10,11
and of Co–Ni
alloys
12
as well as mechanical pressure injection for In–Tl.
13,14
Studies have yet to demonstrate the successful fabrication of
NiTi nanowires though the NiTi alloy are the most commer-
cially successful and intensively-investigated.
15
An ideal syn-
thesis method will have the capability to tune the NiTi alloy
composition and control the dimensions of free-standing
nanowires. Our recent work on NiTi thin films demonstrated
precise NiTi alloy composition control, by sputtering from
elemental Ni and Ti targets, as well as controllable film dimen-
sion and reduced surface roughness.
16,17
Nanoskiving has pro-
duced pure metal (or single material) nanowires from thin
films with controllable dimensions
2,5,6,18–26
and its applica-
bility for fabricating pure titanium (Ti) and nickel (Ni) metallic
films has been assessed.
2
The applicability of nanoskiving to
alloys has yet to be ascertained.
The NiTi alloy compositional ranges that exhibit SMA be-
haviour have a CsCl atomic crystal structure, referred to as
body centered cubic (BCC) B2.
27
It is well known that metallic
material failure is dependent on the atomic crystal structure
and the availability of slip systems; preferred crystallographic
planes and crystallographic directions are for dislocation
motion that produces plastic deformation in metals.
28
When
nanoskiving was undertaken for pure Ni and pure Ti, the Ti
nanowires typically fragmented whereas the Ni nanowires did
not readily fragment so that intact Ni nanowires were produced
that were markedly longer than Ti nanowires.
2,5
The structure
of Ti is hexagonal close-packed (HCP) and the structure of Ni
is face-centered cubic (FCC). The inherent number of available
slip systems in Ti is three and there are twelve for Ni. Due to
the stark differential in available slip systems, the mechanical
response of pure Ti is expected to be brittle whereas Ni should
be ductile and thus the reported fragmentation of Ti is
expected. Since BCC structures can have 12 slip systems, we
hypothesize that the NiTi alloy films will be amenable to
nanoskiving.
The nanoskiving approach for the current NiTi alloy nano-
wires is illustrated in Fig. 1. Sputtering for film deposition and
the ultramicrotome for sectioning can define the nanowire
cross-section dimensions. For this work, the NiTi alloy thin
film was deposited by magnetron co-sputtering from separate
Ti and Ni elemental targets onto an NaCl (100) substrate such
that the film was ∼120 nm thick. Details of the thin film depo-
sition are reported in our previous work.
16,17
In step A, after
film deposition, epoxy (Araldite 502) was cured on the film
† Electronic supplementary information (ESI) available: Detailed procedures and
associated parameters of sputtering NiTi film, embedding film into epoxy, sec-
tioning film into nanowires, transferring nanowire to a V-grid, determining alloy
composition, conducting elemental map and high-resolution TEM. See DOI:
10.1039/c5nr03396a
Department of Engineering Science and Mechanics, The Pennsylvania State
University, University Park, Pennsylvania 16802, USA. E-mail: rfhamilton@psu.edu
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