Materials Science and Engineering B76 (2000) 193 – 199
Densification of hybrid silica – titania sol – gel films studied by
ellipsometry and FTIR
A. Maia Seco *, M. Clara Gonc ¸alves, Rui M. Almeida
Departamento de Engenharia de Materiais /INESC, Instituto Superior Te ´cnico, A. Roisco Pais, 1000 Lisbon, Portugal
Received 25 October 1999; received in revised form 9 February 2000; accepted 1 March 2000
Abstract
Hybrid silica – titania films were prepared via sol – gel processing, by dip-coating on silicon wafer substrates, from organically-
modified silane and titanium isopropoxide precursors. These hybrid sol – gel films were then subjected to selected heat treatments
at temperatures up to 950°C and their densification was followed by ellipsometry and infrared absorption (FTIR) spectroscopy.
The volume fraction of residual porosity was estimated, based on the refractive index data. A clear correlation was observed
between the intensity of the infrared spectral shoulder near 1150 cm
-1
and the porosity values, for the different heat treatment
temperatures. For any treatment up to 950°C, the porosity of the hybrid silica–titania gel films was higher than that of the
corresponding inorganic gel films, while both continuously decreased with increasing heat treatment temperature. The residual
SiCH
3
groups, whose presence was identified in the hybrid silica – titania films until a temperature near 500°C, tend to be
transformed into SiOH (silanol) groups as they are eliminated. Most silanol groups are eliminated at a temperature near 600°C.
The hybrid silica–titania films were found to have a more porous and more compliant gel network than the corresponding
inorganic films, while their structure appears to exhibit a smaller spread in the SiOSi intertetrahedral angle distribution. © 2000
Published by Elsevier Science S.A. All rights reserved.
Keywords: Silica – titania films; Hybrid sol – gel films; Ellipsometry; Infrared absorption (FTIR) spectroscopy
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1. Introduction
For optical communications systems, bulk optics is
not convenient in large-scale applications, because of
the sensitivity of such systems to temperature changes
and mechanical vibrations, whereas integrated optics
(IO) is a planar waveguide-based technology which
allows the implementation of systems with much
smaller dimensions than bulk optics, e.g. centimeters
rather than meters. For the fabrication of IO compo-
nents, silica-on-silicon is a leading technology at
present, using processing methods such as thermal oxi-
dation, sputtering, flame hydrolysis, chemical vapor
deposition or sol–gel [1]. Sol–gel processing offers
advantages over the other methods in terms of compo-
sitional tailoring, functionality and cost. In particular,
active doping of silica – titania sol – gel planar waveg-
uides with cations such as Nd
3 +
and Er
3 +
has yielded
very promising results [1 – 3].
In order to increase the single layer thickness of the
sol–gel deposits above a critical thickness of about 0.5
m before cracking occurs during densification [4], it is
advantageous to use organically-modified precursors
for the preparation of hybrid (organic/inorganic) films.
Such precursors, containing non-hydrolizable groups
like SiR, where R is an alkyl radical, lead to films with
reduced network connectivity and, therefore, increased
compliance, allowing easier densification without crack-
ing. Whereas the structure [5 – 12] and thermal densifi-
cation behavior [13,14] of inorganic silica – titania
sol – gel planar waveguides has already been investi-
gated to some extent, very little has been published so
far about hybrid silica – titania waveguides. Brusatin et
al. [15] prepared silica – titania coatings from acid cata-
lyzed solutions of methyltriethoxysilane (MTES) and
tetraethoxysilane (TEOS), mixed with tetrabutoxyti-
tanate and they found that these films became purely
inorganic and similar to those prepared without MTES,
after treatment at 500°C; the optical propagation losses
of these waveguides were ca. 0.3 dB cm
-1
. * Corresponding author.
0921-5107/00/$ - see front matter © 2000 Published by Elsevier Science S.A. All rights reserved.
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