ISSN: 2277-9655
[Alwan* et al., 6(1): January, 2017] Impact Factor: 4.116
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IJESRT
INTERNATIONAL JOURNAL OF ENGINEERING SCIENCES & RESEARCH
TECHNOLOGY
EFFECTS OF THE POROUS SILICON MORPHOLOGY ON THE GAS SENSOR
PERFORMANCE
Dr. Alwan M. Alwan*, Ruaa A Abbas
*
School of Applied sciences, University of Technology/Baghdad
Ministry of Science and technology / Baghdad
DOI: 10.5281/zenodo.245646
ABSTRACT
In this work,porous silicon (PSi) based gas sensor of structure (AL/nPSi/n-Si/AL) at different morphologies was
prepared on the n-type silicon substrate using IR illuminated source of wavelength (810nm). The morphological
and gas sensing properties of the sample were studied, under various etching time (5-20min). The current density
–voltage characteristic at temperaturefrom 25 to 150 °C of the sensor,which was sensitivity analysis based on the
silicon nano size, porosity, layer thickness, and effective dielectric constant of the PSi layer.The SEM image of
the PSi layer showed the formation single layer structure pore –like the cylindrical and rectangular pore shape.
The porous layer after etching time (5-10min) and double of mud _like for 20min produced different dimensions
with randomly distributed as an upper layer and pore _like structure as a lower layer. The current density–voltage
analysis confirms that higher temperatures with the presence of CO2 gas lead to sharply increase the sensitivity
with the current and voltage. Overall, the improvement that appeared on the double porous layer sensitivity due
to the higher value of the surface area.
KEYWORDS: poroussilicon,surfacemorphology, gas sensor,carbon dioxide.
INTRODUCTION
Porous silicon (PSi) is considered as a very efficient material in the chemical sensor due to its unique properties
which dependent on the large surface area [1]. That change in morphology of porous silicon can be obtained by
the variety of etching condition through several parameters such as current density, etching time, HF acid
concentration and illumination conditions. [2]. photo electrochemical etching of silicon by using HF acid is a well-
known technique for porous silicon fabrication. The electrochemical and photochemical etching method is a
combination of the material interaction with the HF acid through light and current density. It has been used laser
light illuminating on the silicon electrode during the anodization process and was effect its greatly in modifying
of the macro-porous properties [3]. That control of the high surface area within a small volume of the pore sizes
given an increase in sensor characteristics.The ability to modulate dielectric constant as a function filling
moleculesmakes of the Psi a suitable dielectric material for the gas detection process [4]. All these features are
lead to consider the Psi as one of the most valuable materials in the field of gas sensor technology. The Psi sensor
is simple and cheap method as compared to other gas detectors that are super-sensitive could be based on Psi
elements resistive [5]. The morphology and a reduced particle size play a significant role in the gaseous sensor
applications, due to the increase of the specific surface area.On the other hand, Psi sensitivity is dependent also
on the chemical adsorption and the physical adsorption of the gasses [6. 7]. The detection of carbon dioxide
currently used in critical fields such as indoor air quality monitoring [8, 9]. The sensing devices Most of the
currently available carbon dioxide are based on optical principles but they are usually bulky and expensive. In this
research has been a study of several development groups in the alternative sensor for CO2 monitoring which is
cheap and efficient. The semiconductor materials are always a competitive low-cost choice in many areas [10]. In
this research was the study focus on the porous silicon morphology on the CO2 gas detection process. The
electrical behavior in the sensing properties of (AL/nPSi/n-Si/AL) has been investigated at different temperature
with the morphologies of the Psi layer.