ISSN (Print) : 2319-5940 ISSN (Online) : 2278-1021 International Journal of Advanced Research in Computer and Communication Engineering Vol. 2, Issue 9, September 2013 Copyright to IJARCCE www.ijarcce.com 3344 Design and Simulation of Nanotechnology based Proximity Coupled Patch Antenna at X-Band Rajendra R. Patil 1 , Vani R.M 2 , P.V. Hunagund 3 Research Scholar, Dept. Of Applied Electronics, Gulbarga University, Gulbarga, India 1 Professor, University Science Instrumentation Centre, Gulbarga University, Gulbarga, India 2 Professor, Dept. of Applied Electronics, Gulbarga University, Gulbarga, India 3 Abstract: This paper presents design, modeling and simulated characterization of proximity coupled fed circular microstrip patch antenna (PCMPA) where the electromagnetic radiating patch is totally composed of nano thickness (nano meter) film. The nano film is excited through an electromagnetic coupling scheme also known as proximity coupler at 10 GHz. Antenna design and parametric studies have been executed through IE3D version 14.65 simulation software. Simulation result shows enhanced bandwidth and good return loss response of nano film patch antenna over traditional bulk thickness (micro meter) patch antenna. Since, the resonance frequency of this antenna is around 10 GHz; these antennas are suitable for X- band applications such as satellite communication, radar, medical, and other wireless systems. Keywords: X-band, Patch antenna, nanotechnology, IE3D, proximity coupled patch antenna I. INTRODUCTION In recent years microstrip patch antennas (MPA) have been widely used in microwave frequencies for wide range of applications such as industry, military, and wireless systems etc. MPA offer the attractive advantage of low profile, low weight, simple fabrication, and easy integration with integrated circuits. The present day wireless communication system applications demand smaller antenna size and enhanced bandwidth. However, MPAs have disadvantage of narrow bandwidth, low gain and low power handling capacity [1]. There have been a lot of researches on MPAs to widen the band width. A part of them has focussed on employed antenna substrate. Magneto Dielectric (MD) substrates with permeability r (ȝ ) and permittivity r (İ ) values greater than one having favourable properties have been proposed as possible substrates for antennas in [2-3]. The MD material consists of some metallic or ferrite material so that permeability of substrate can be changed easily. The bandwidth for an antenna over a MD material substrate is approximately given by [4]: (1) where t is thickness of the MD material and 0 Ȝ is the wavelength at resonant frequency. The term r r ȝİ is called refractive index or miniaturization factor n. Higher the value of n, the smaller the size of an antenna. It is seen that when r r ȝ =İ , the characteristics impedance of MD medium is close to that of the surrounding medium, it allows ease of impedance matching over a wider bandwidth. The size of the antenna is unchanged because of refractive index n, the bandwidth can be broader by increasing the ratio between permeability and permittivity. However the use of MD substrate at GHz frequencies is limited by high magnetic loss m (tanį ) . The other problem with MD substrate is difficult to synthesize and fabricate material for r r ȝ =İ . The other part of researches on electrically small patch antenna is optimizing conductive parts of the antenna. Different techniques like meandering line technique; capacitive loading, inductive loading and employing parasitic stubs etc have been used in conjunction with the main antenna pattern to widen the bandwidth in addition to miniaturization [5-7]. However this arrangement reduces radiation efficiency. Also, MPAs at higher microwave band offer higher metallic losses there by reducing the bandwidth, radiation efficiency and gain. Recently new technologies and nano materials have been developed to allow the fabrication of patch antennas. One of the technologies is to deposit required amount of conductive patch material on the dielectric substrate using nanotechnology tools like Physical (PVD) or chemical vapor deposition (CVD) method [8], instead of removing the unwanted metal from a fully covered dielectric substrate which uses conventional lithography. F. Urbani, D.W. Stollberg, and A. Verma have developed and demonstrated r r 0 r r t 96 ȝ /İ Ȝ BW 24 17 ȝİ 