39 SystemC-AMS Thermal Modeling for the Co-simulation of Functional and Extra-Functional Properties YUKAI CHEN, Politecnico di Torino, Italy SARA VINCO, Politecnico di Torino, Italy ENRICO MACII, Politecnico di Torino, Italy MASSIMO PONCINO, Politecnico di Torino, Italy Temperature is a critical property of smart systems, due to its impact on reliability and to its inter-dependence with power consumption. Unfortunately, the current design fows evaluate thermal evolution ex-post, on ofine power traces. This does not allow to consider temperature as a dimension in the design loop, and it misses all the complex inter-dependencies with design choices and power evolution. In this paper, by adopting the functional language SystemC-AMS, we propose a method to enable thermal/power/functional co-simulation. The system thermal model is built by using state-of-the-art circuit equivalent models, by exploiting the support for electrical linear networks intrinsic of SystemC-AMS. The experimental results will show that the choice of SystemC-AMS is a winning strategy for building a simultaneous simulation of multiple functional and extra-functional properties of a system. The generated code exposes an accuracy comparable to that of reference thermal simulator HotSpot. Additionally, the initial overhead due to the general purpose nature of SystemC-AMS is compensated by surprisingly high performance of transient simulation, with speedups as high as two orders of magnitude. The application of the proposed methodology to a set of benchmarks, used for the IEEE PATMOS design contest, will additionally prove the efectiveness of the SystemC-AMS thermal simulator. CCS Concepts: · Computing methodologies → Modeling and simulation; · Hardware → Temperature simulation and estimation; Additional Key Words and Phrases: Thermal analysis; Thermal estimation; Simulation; SystemC-AMS ACM Reference Format: Yukai Chen, Sara Vinco, Enrico Macii, and Massimo Poncino. 0. SystemC-AMS Thermal Modeling for the Co-simulation of Functional and Extra-Functional Properties. ACM Trans. Des. Autom. Electron. Syst. 0, 0, Article 39 ( 0), 27 pages. https://doi.org/0000001.0000001 1 INTRODUCTION Assessment of extra-functional properties of an electronic system such as power consumption, reliability and thermal profle, is crucial to ensure correct operations; they should be considered at all design stages and concurrently, due to their complex interactions. While the modeling and simulation of such properties in isolation is a widely studied problem, the management of their inter-dependence and interaction at run time is only partially solved. In this scenario, temperature Authors’ addresses: Yukai Chen, Politecnico di Torino, Department of Control and Computer Engineering, Turin, Italy; Sara Vinco, Politecnico di Torino, Department of Control and Computer Engineering, Turin, Italy; Enrico Macii, Politecnico di Torino, Department of Control and Computer Engineering, Turin, Italy; Massimo Poncino, Politecnico di Torino, Department of Control and Computer Engineering, Turin, Italy. Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for proft or commercial advantage and that copies bear this notice and the full citation on the frst page. Copyrights for components of this work owned by others than the author(s) must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specifc permission and/or a fee. Request permissions from permissions@acm.org. © 0 Copyright held by the owner/author(s). Publication rights licensed to the Association for Computing Machinery. 1084-4309/0/0-ART39 $15.00 https://doi.org/0000001.0000001 ACM Transactions on Design Automation of Electronic Systems, Vol. 0, No. 0, Article 39. Publication date: 0.