Aalborg Universitet General 3D Lumped Thermal Model with Various Boundary Conditions for High Power IGBT Modules Bahman, Amir Sajjad; Ma, Ke; Blaabjerg, Frede Published in: Proceedings of the 31st Annual IEEE Applied Power Electronics Conference and Exposition (APEC) DOI (link to publication from Publisher): 10.1109/APEC.2016.7467882 Publication date: 2016 Document Version Accepted author manuscript, peer reviewed version Link to publication from Aalborg University Citation for published version (APA): Bahman, A. S., Ma, K., & Blaabjerg, F. (2016). General 3D Lumped Thermal Model with Various Boundary Conditions for High Power IGBT Modules. In Proceedings of the 31st Annual IEEE Applied Power Electronics Conference and Exposition (APEC) (pp. 261 - 268). IEEE. https://doi.org/10.1109/APEC.2016.7467882 General rights Copyright and moral rights for the publications made accessible in the public portal are retained by the authors and/or other copyright owners and it is a condition of accessing publications that users recognise and abide by the legal requirements associated with these rights. ? Users may download and print one copy of any publication from the public portal for the purpose of private study or research. ? You may not further distribute the material or use it for any profit-making activity or commercial gain ? You may freely distribute the URL identifying the publication in the public portal ? Take down policy If you believe that this document breaches copyright please contact us at vbn@aub.aau.dk providing details, and we will remove access to the work immediately and investigate your claim.