Risk Assessing the Use of Variable Pressure SEM for the Examination of
Cultural Heritage Artefacts
Alexander D. Ball,* and Anton Kearsley*
*Electron Microscopy and Mineral Analysis Division, Department of Mineralogy, The Natural
History Museum, London, SW7 5BD, UK.
Variable pressure SEM (VPSEM) combined with microanalysis to provide detailed compositional
information has become the method of choice for high resolution imaging and analysis. However, the
SEM chamber is not a benign environment for delicate and often unique artefacts [1][2][3].
Understanding the risks associated with the examination of samples using VPSEM should be a vital
part of every research project involving cultural heritage materials. However, there is a lack of
information about what actually happens within the chamber.
Our study investigated methods for quantitative assessment of contamination within the SEM under
a wide range of operating conditions and using different chamber gases. We propose a simple and
repeatable technique to assess an individual SEM to determine how likely it is to contaminate or
damage a sample (Fig. 1). The technique requires access to an EDX system and measures the
conditions in the microscope directly. As such, it represents an improvement on the rather qualitative
or instrumentally demanding procedures which have previously been proposed [4]. It could be
adopted as part of a routine quality control monitoring process of the instrument, by researchers
visiting another institution or amongst collaborators to ensure the proper handling of loaned samples.
Within the VPSEM, samples are exposed to rapid decompression and recompression. The
interactions between the imaging gas (usually nitrogen, air or water vapour), the beam and the
sample are complex [5] and can lead to the deposition of contaminants (derived from the vacuum
system, the instrument itself or from the sample) (Figs 2 and 3) [6] and the formation of corrosive
products (e.g. hydroxyl and oxygen radicals)(Fig. 4) [7]. The beam also contains sufficient energy to
damage the sample directly [1][2][3], especially when it is maintained in one place for an extended
period of time (for example, during spot analyses). The combination of these effects can lead to the
sample being materially altered during examination within the microscope or the acquisition of
inaccurate or misleading data [8]. We suggest that a proper understanding of the conditions involved
can lead to an informed risk assessment of the procedure which can only improve the quality of care
for the collections which many of us curate or study.
References
[1] T. Zheng, K.W. Waldron and A.M. Donald. Planta, 230 (2009) 1105-1113.
[2] Y.L. Ren, A.M. Donald and Z.B. Zhang. Materials Science and Technology, 23 (2007) 857-864.
[3] S.E. Kirk, J.N. Skepper, A.M. Donald. Journal of Microscopy, 233 (2009) 205-224.
[4] A.E. Vladár, K.P. Purushotham and M.T. Postek. Metrology, Inspection and Process Control for
Microlithography XXII. Proc. of SPIE 6922 (2008) 692217-1-5.
[5] C. Mathieu. Scanning Microscopy, 13 (1999) 23-41.
[6] R. Vane, and V. Calino. Proceedings Microscopy and Microanalysis (2005) 900CD
[7] C.P. Royall, B.L. Thiel and A.M. Donald. Journal of Microscopy, 204 (2001) 185-195.
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doi:10.1017/S1431927611009895
Microsc. Microanal. 17 (Suppl 2), 2011
© Microscopy Society of America 2011
https://doi.org/10.1017/S1431927611009895
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