Numerical investigation of counter ow microchannel heat exchanger with MEPCM suspension Mushtaq I. Hasan * Mechanical Engineering Department, College of Engineering, Thi-Qar University, Thi-Qar, Iraq article info Article history: Received 12 March 2010 Accepted 28 November 2010 Available online 7 December 2010 Keywords: Counter ow Microchannel heat exchanger MEPCM Phase change material Thermal performance abstract The aim of this paper is to study the ow and heat transfer of microencapsulated phase change material (MEPCM) suspension in counter ow microchannel heat exchanger (CFMCHE) and its effect of the performance of this heat exchanger when using this suspension as a coolant instead of pure uid. The hydrodynamic and thermal characteristics of this suspension ows in microchannels of CFMCHE is numerically investigated. The MEPCM suspension used in this paper consists of microcapsules con- structed from n-octadecane as a phase change material (PCM) and the shell material is poly- methylmethacrylate, these capsules are suspended in water in a concentration of (0e20)%. From the results, using of MEPCM suspensions as a cooling uid lead to modify thermal performance of a CFMCHE by increasing its effectiveness but it also lead to increase the pressure drop. From heat transfer (thermal performance) point of view it is better to use this type of uid to increase cooling efciency of a CFMCHE, but due to extra increase in pressure drop it leads to reduce the overall performance compared with pure uids. Therefore its use depends on the application at which this heat exchanger is used. Ó 2010 Elsevier Ltd. All rights reserved. 1. Introduction Microchannel heat exchangers are of interest because they can remove large amount of heat over a small volume. This ability makes it well suited for highly specic applications that require compact high heat energy removal solutions such as, biomedical processes, metrology, telecommunications, cooling of high heat ux high density microelectronics, automotive industries, nuc- lear reactor barriers, fuel processing, aerospace and chemical industries. Cooling uids play an important role in cooling applications, and its thermo physical properties considered as key parameters that affect its cooling abilities. All the observed literature used pure uids (liquids and gases) as cooling uids in a CFMCHE. Using microencapsulated phase change material (MEPCM) suspensions has attracted more and more interest due to their capabilities of enhancing convective heat transfer and thermal storage performance. This heat transfer enhancement results from the latent heat absorption by the PCM in the suspended MEPCM particles during the melting process. Microchannel heat sink was rst proposed by Tuckerman and Pease [1] for electronic cooling. They built a water cooled integral heat sink with microscopic ow channels, and demonstrated that extremely high power density with a heat ux as high as 790 W/ cm 2 could be dissipated . Following the work of Tuckerman and Pease, many researches have been conducted for microchannels and microchannel heat sinks. Klein et al. [2] studied experimentally the effects of surfac- tants solution on heat transfer of a single phase and boiling ows in microchannel heat sinks. The surfactant used is Alkyl Poly Glyco- sides (APG). The results were compared with the heat transfer in water ow under similar conditions. For single phase ow, no signicant difference was observed between heat transfer in water and surfactant solutions at various mass concentrations. For boiling ow of surfactant solutions, the optimal value of mass ux was found in which the heat transfer enhancement reached its maximum. The experiment has also revealed that at low mass uxes, an optimal mass concentration of APG additives may be found for which a two phase ow heat transfer signicantly increases. These ndings lead to the conclusion that the use of surfactants should be considered as a method for improving two phase boiling ow heat transfer. Yu et al. [3] experimentally investigated the laminar ow characteristics of suspensions with microencapsulated phase * Tel.: þ9647801140094. E-mail address: mushtaq76h@yahoo.com. Contents lists available at ScienceDirect Applied Thermal Engineering journal homepage: www.elsevier.com/locate/apthermeng 1359-4311/$ e see front matter Ó 2010 Elsevier Ltd. All rights reserved. doi:10.1016/j.applthermaleng.2010.11.032 Applied Thermal Engineering 31 (2011) 1068e1075