Journal of Electroanalytical Chemistry 467 (1999) 307 – 324
In-situ STM investigation of specific anion adsorption
on Cu(111)
P. Broekmann *, M. Wilms, M. Kruft, C. Stuhlmann, K. Wandelt
Institut fu ¨r Physikalische und Theoretische Chemie der Uniersita ¨t Bonn, Wegelerstr. 12, D-53115 Bonn, Germany
Received 2 October 1998; received in revised form 13 January 1999; accepted 22 January 1999
Abstract
The specific anion adsorption of chloride and sulfate on Cu(111) from acidic aqueous electrolytes has been studied using
scanning tunneling microscopy (STM) and cyclic voltammetry. At positive potentials adsorbed chloride forms a well ordered
(3 ×3)R30° superstructure; at negative potentials the bare copper surface can be imaged with atomic resolution. By use of
a so-called potentiodynamic STM measurement it is possible to correlate directly the appearance and the disappearance of the
chloride superstructure to the anodic and the cathodic peak in the cyclic voltammogram. The chloride adsorbate influences the
surface topography strongly in such a way that copper steps preferentially run along close packed chloride rows after chloride
adsorption. An enhanced surface mobility caused by the chloride adsorbate leads to an ‘electrochemical annealing’ effect. Surface
defects such as pits heal rapidly and the decay of copper stacks is promoted. Although the cyclic voltammograms of Cu(111) in
chloride acid electrolyte and in sulfuric acid electrolyte are similar, both showing characteristic adsorption and desorption peaks,
the surface structures and the adsorption kinetics are extremely different. At positive potentials the sulfate adsorbate forms an
anisotropic Moire ´ structure which occurs in three rotational domains. High resolution STM images reveal an additional species
which is assigned to coadsorbed water molecules. Close packed sulfate rows are separated by zig-zag chains of these water
molecules. The short range lattice vectors of the sulfate structure are similar to those found for sulfate adlayers on other fcc(111)
surfaces (Au, Pt, Rh). Due to a strong kinetic hindrance it is possible to observe directly the mechanism of the sulfate adlayer
formation and the decay process. The Moire ´ formation starts locally at upper step edges and spreads from the step edges over
the upper terraces. During the adlayer formation process a mass transport out of the top copper layer takes place, resulting in
a drastic change of the surface topography due to the formation of characteristically shaped islands and step edges. Different
models are discussed explaining the long range periodicity of the Moire ´ pattern and the topographic changes during the adlayer
formation and decay processes. © 1999 Elsevier Science S.A. All rights reserved.
Keywords: In situ STM; Adsorption kinetics; Copper; Sulfate adsorption; Chloride adsorption; Low index single crystal surfaces; Solid liquid
interfaces; Superlattices
1. Introduction
In recent years our understanding of the processes
occurring at interfaces between solid electrodes and the
electrolyte has been revolutionized by the use of in-situ
probes with structural sensitivity, mainly scanning tun-
neling microscopy (STM) and X-ray diffraction. These
techniques have been able to unravel details about
solid liquid interfaces with unprecedented accuracy.
Such studies became possible only with the use of
single-crystal electrodes which provide macroscopic sur-
face areas with a well-defined substrate structure. In the
late seventies it became clear that the use of single
crystal electrodes was not only feasible, but also liable
to yield new insights, because the electrode structure on
an atomic level has a profound bearing on electrochem-
ical processes. Clavilier suggested a simple technique
for the preparation of Au and Pt single crystal elec-
trodes, the famous flame annealing procedure [1,2],
Dedicated to Jean Clavilier on the occasion of his retirement
from LEI CNRS and in recognition of his contribution to Interfacial
Electrochemistry.
* Corresponding author.
0022-0728/99/$ - see front matter © 1999 Elsevier Science S.A. All rights reserved.
PII:S0022-0728(99)00048-0