International Refereed Journal of Engineering and Science (IRJES) ISSN (Online) 2319-183X, (Print) 2319-1821 Volume 3, Issue 2 (February 2014), PP.104-114 www.irjes.org 104 | Page Novel Compact Microstrip Filtenna Structures Reham Hamdy Zaghloul 1 and Hussein H. M. Ghouz 2 1 Master Student in Department of Electronics and Communications Arab Academy for Science, Technology & Maritime Transport (AASTMT), Cairo, Egypt 2 Associate Professor in Department of Electronics and Communications Arab Academy for Science, Technology & Maritime Transport (AASTMT), Cairo, Egypt Abstract:- In this paper, Microstrip Filter_Antenna structures “MFA” have been proposed, analyzed and investigated in details using the CST_MW Studio. This was carried out using a full parametric study of reconfigure the ground plane along with a rectangular defected patch shape. Reconfigurable ground structure “RGS” includes partial ground “PG” (single ground strip), and Digital ground “DG” (N_Isolated ground strips). Defected patch “DP” includes H_Slot shape and Edge_Slot shape, where the overall patch dimensions are kept constant. The proposed MFA structures are mounted symmetrically on a lossy FR-4 substrate having RGS and arbitrary slots shape near the patch edge. The proposed MFA structures are referred to as H_Slot patch filtenna “HSPF” and Edge_Slot patch filtenna “ESPF”. Simulation results showed that the proposed filtennas resonate at multi-frequencies having different operating bands (narrowband, broadband, and ultra- wideband). The presented filtennas are very simple circuits and very compact in size. Furthermore, they cover a wide frequency spectrum for many wireless applications (4G wireless systems). Keywords:- Microstrip Antenna_Filter, Planar Antennas, Microstrip Filtennas I. INTRODUCTION Microstrip antenna configuration has numerous benefits in wireless communication systems applications. This is due to its small size, low cost, less weight, and easy to fabricate. Furthermore, microstrip antenna has an excellent compatibility with the MMIC planar circuits. Microstrip Filter_Antenna structure “MFA” is a planar antenna circuit having a built-in filter(s), and it is referred to as Microstrip Filtenna. In fact, it is employed in the receiver front end to relieve the necessity of using a band pass and/or band rejection filters. These filters having different specific characteristics which depend upon the antenna patch and ground geometries. Little work has been done to investigate and analyze different MFA structures [1-4]. These structures can be with arrays of bandpass frequency-selective surfaces or with band-rejection elements and or fractal defected ground structure. Other work including MFA structures has been done recently [5-10]. These structures are done by using electromagnetic band gap (EBG) structures, partitioned ground, and double/single T-shaped structures. In addition, MFA structures can utilize an active element to tune their resonance frequencies [11-13]. These active elements can be used by varactor diode to tuned rings fed. In this paper, two proposed and compact microstrip filtenna structures are analyzed, investigated, optimized and presented. These are H_Slot patch filtenna “HSPF” and Edge_Slot patch filtenna “ESPF”. The characteristic of theses filtennas is mainly depending on the ground configuration as well as the patch slot geometries. It has been reported that the performance of H_Slot patch filtenna with full and/or defected ground structure depends on the H_slot dimensions, location, and orientation. Such filtenna has multi resonances frequencies having different bands [14]. The presented paper is organized among four sections. A detailed description of the proposed H_Slot patch and Edge_Slot patch microstrip filtenna configurations is presented in section II. Simulation results of the proposed filtenna structures are presented and discussed in section III. Finally, section IV concludes the presented paper. II. DESCRIPTION OF THE PROPOSED FILTENNA CONFIGURATIONS Two filtenna configurations are proposed and presented in Fig. 1 (HSPF and ESPF). These Filtennas have been mount on a single FR-4 substrate (ε r =4.7, and 1.6 mm height with tangential loss of 0.025), and the conductor thickness is 0.035 mm. The dimensions of the substrate are L Sub =30 mm and W Sub =30 mm, while the basic patch dimensions are L P =13.5 mm and W P =13.5 mm (conventional patch). A transmission line of 50 Ohm is used to feed the patch with width length L F =10.0 mm and W F =2.86 mm. Partial ground “PG” and digital ground “DG” configurations are shown in Fig. 2. The length of partial ground “L pg ” has been optimized in case of conventional microstrip patch (without either H_slot or Edge_Slot) and it is equal to 8.5 mm. The digital ground “DG” consists of three isolated strips and it has two parameters. These are the inter-spacing between any