Aalto University School of Electrical Engineering Jarmo Kemppainen Adhesion Evaluation of the Heat Resistant Pressure Sensitive Adhesives at Elevated Temperatures for MEMS Gyroscope Testing This thesis is submitted in partial fulfillment of the requirements for the degree of Master of Science in Technology. Helsinki, 1.8.2011 Supervisor _____________________________ Professor Mervi Paulasto-Kröckel School of Electrical Engineering Instructor _____________________________ Toni Mattila, Docent School of Electrical Engineering