JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS ! (1990) 75-78
Deep levels in GaAs/AIGaAs multi-quantum
well structures
A. ARBAOUI, B. TUCK, C. J. PAULL, M. HENINI*
Department of Electrical and Electronic Engineering, and *Department of Physics, University of
Nottingham, Nottingham, UK
The study of the behaviour of deep traps in AIxGal_xAs/n-GaAs multi-quantum well struc-
tures with three different well widths (1.7, 2.5 and 3.4 nm) has been performed using deep
level transient spectroscopy. The measurements showed the presence of two closely spaced
levels in each structure in the temperature range 160 to 270 K. It was found that as the GaAs
well width increased, the apparent activation energies and the concentrations of both levels
decreased. It is seen that in the 1.7 nm well samples, the lower temperature level is dominant,
but in the 2.4 and 3.4 nm welt samples, both levels were comparable in concentration.
1. Introduction
Since the pioneering work of Esaki and Tsu [1], there
has been considerable interest in superlattices either as
active layers in the device structures or as substrates
for optoelectronics devices. For successful operation
of both minority and majority carrier devices with
superlattices, it is important to detect and control the
presence of electrically active defects in the super-
lattice structures. Previous studies have shown that by
replacing the doped A1GaAs layer in the MODFET
structure with a superlattice structure [2, 3], it is
possible to reduce the troublesome persistent photo-
conductivity effect associated with the DX centre in
the A1GaAs alloy. Moreover, it has been reported that
with regard to deep traps within the superlattices
both the period magnitude and the number of periods
involved may play an important role affecting the
concentration of deep levels and the interpretation of
their characteristics [4-6].
Thi s paper reports the results of an investigation
into the behaviour of deep traps in A10.4Ga06As/
n-GaAs multi-quantum well structures using the deep
level transient spectroscopy (DLTS) technique to
obtain results as a function of GaAs well width.
2. Experimental procedure
The samples were prepared by molecular beam
epitaxy (MBE) on (1 00) oriented GaAs substrates
grown by the liquid encapsulated Czochralski process.
The GaAs substrates were heavily doped with silicon
(2 x t0 ~ cm-3). Each sample consisted of a GaAs
buffer layer grown on top of a conducting GaAs
substrate, followed by a multi-quantum well structure
(MQW) consisting of alternating layers of silicon-
doped GaAs and undoped A1,Ga~ ~As (x = 0.4). A
total of 60 periods of GaAs/A1,.Ga~_,As were grown.
Fig. t shows the layer structure of the samples. Three
samples were grown, with GaAs layer thicknesses of
3.4, 2.5 and 1.7 nm, respectively; the AI~Ga~_,As layer
thickness of 29.7 nm was identical for all samples. The
0957-4522/90 $03.00 + .12 © 1990 Chapman and Hall Ltd.
GaAs layers in all samples were doped to 10 ~scm ~. A
total MQW thickness of 1.904 #m or greater was used
in each sample to avoid depleting the substrate in the
measurement process. Growth parameters were iden-
tical for the three samples with the sole exception of
the GaAs well layer thicknesses.
For diode fabrication, ohmic contacts were first
formed on the backside of n + silicon-doped GaAs
substrate by evaporation of Ni-Ge-Au contacts and
alloying at 400 ° C in an Ar/H2 atmosphere for 15 sec.
Prior to the evaporation of Schottky barriers, surface
cleaning was carried out on the semiconductor slices.
The cleaning procedure was employed to remove as
much surface contamination as possible. Schottky
barrier diodes were formed by evaporating aluminium
on the top of a sample in a vacuum of 10 -6 torr
(1 torr = 133.322Pa).
The experimental techniques used for electrical
characterization of the Schottky barrier diodes were
current-voltage (I-V) measurement, capacitance-
voltage (C-V) measurement, and DLTS. The I-V
characteristic gives a general description of the diode
quality; C-V characterization is used to obtain the
shallow dopant concentrations and the doping profile.
In this paper the MQW supertattice structure will be
viewed as a perturbed bulk crystal rather than as a
series of junctions [1]. All diodes show a forward
turn-on voltage of about 0.5 V and a reverse break-
down voltage between 8 and 15V. C-V profiling con-
firmed the doping level, but did not show the periodic
variation of carrier concentration in any of the
samples.
A microcomputer-based DLTS system was used to
measure deep-level parameters. The principle of the
measurement and the experimental procedure have
been reported elsewhere [7]. Typically the capacitance
transients are recorded under isothermal conditions
rather than during temperature scans using a fixed
apparatus time constant.
DLTS measurements were performed only on
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