International Journal of Enhanced Research in Science Technology & Engineering, ISSN: 2319-7463 Vol. 2, Issue 4, April-2013, pp: (11-18), Available online at: www.erpublications.com Page | 11 Infrared Microbolometer: Design, Development and Characterization Manjunath D. M * , Beno Thomas, S. P. Karanth, Sumesh M. A., Satheesh Rao * , C L Nagendra Laboratory for Electro-Optics Systems (LEOS), Indian Space Research Organization (ISRO), 1 st Stage, 1 st Phase Peenya Industrial Area Bangalore-058 * Dept. of Electronics and Communication, NMAM Institute of Technology, Nitte, Karnataka, India Abstract: In the present paper, an uncooled 32x32 pixels microbolometer array has been developed by surface micromachining technology, A suitable readout electronics was designed for reading the individual pixel value, Then array together with the electronics was characterized in front of the blackbody radiation source and results were discussed. Keywords: Micromachining, Responsivity, MEMS, IR detectors, NEP (Noise Equivalent Power). 1. INTRODUCTION Infrared system technology has been developed for various application including IR search and track, Medical examination, astronomy, forward looking infrared system missile guidance and other strategic equipment. Recently a dual use technology concept has been proposed which emphasizes the integration of commercial and military IR imaging system to meet both economic and defense challenges. This concept has led to the increasing research and development efforts in VLSI technology in the design of ir imaging system. In infrared focal plane array technology like detector material sensing structure, optics, coolers, readout electronics, image enhancement and intelligent signal processing results in the revolution of IR systems to new generation with significant performance improvement. In generally Infrared FPA (Focal Plane Array) can be categorized as two major parts namely detector array and readout electronics as compared to conventional discrete design, the IR FPA has the inherent advantage of larger packing density, lower cost, reduced harness complexity, high feasibility on–chip data processing, and high adjustability for integration of the system. In the high sensitivity applications, the IR FPAs are typically fabricated with narrow band gap photon detectors and cryogenic cooling [3] is required for this environment. Thus, very challenging technologies for detection materials and system interface are required. Moreover, high performance and low temperature mixed mode circuit designs are also required for the readout electronics. To achieve the optimal overall performance of the IR FPA‘s, suitable circuits of good performance, power dissipation, chip area, image resolution should be made. A number of readout has been developed for different system applications and concerns. 2. Microbolometer Development Bolometers are thermal IR detectors that absorb electromagnetic radiation and thus increase their temperature. the resulting temperature increase is a function of the radiant energy striking the bolometer and is measured with resistive temperature sensing principle .The structure of bolometer is a small resistive material, suspended above the substrate, which will reduce the thermal mass and isolating the detector from the ambient to preserve heat in the detector .This can be achieved by making self supported microbolometer as shown in Figure 1, Fig. 1 Basic structure of microbolometer pixel [2]