World Applied Sciences Journal 35 (11): 2433-2444, 2017 ISSN 1818-4952 © IDOSI Publications, 2017 DOI: 10.5829/idosi.wasj.2017.2433.2444 Corresponding Author: Zakaria El Haddad, Abdelmalek Essaâdi University, Faculty of Sciences, Modeling and Simulation of Mechanical Systems Laboratory, BP.2121, Mhannech, 93030, Tetouan, Morocco. 2433 The Fatigue Life Prediction Analysis of Solder Joint in BGA Packages Under Mechanical Cyclic Bending Loading and Their Probability of Failure Using FORM and SORM Methods Zakaria El Haddad, Othmane Bendaou and Larbi El Bakkali Modeling and Simulation of Mechanical Systems Laboratory, Abdelmalek Essaâdi University, Faculty of Sciences BP.2121, Mhannech, 93030, Tetouan, Morocco Abstract: Nowadays electronics play a crucial role in several applications: medicine, embedded systems of transportation and telecommunication. While achieving electrical functions, electronic systems must be safe, reliable, have low thermal resistance (To dissipate the heat properly) and must be durable and insensitive to the exterior environment variations (Humidity, thermal and mechanical shock ...) In this study a three- dimensional finite element simulation using ANSYS 15.0.7 APDL on solder joint in a Ball Grid Array (BGA) under Mechanical cycling bending test was executed to predict the fatigue life of solder joint. To predict the latter, we divide our simulation analysis into e three parts as follows: First: three-dimensional finite element analysis for calculating the stiffness assembly and imposed strain values. Second: one dimensional conjoint creep and time independent plastic deformation analysis under mechanical cyclic bending loading for calculating the inelastic strain energy. And finally, the life prediction analysis. Even when the solder joint under mechanical cyclic bending loading reaches the steady-state response, the three-dimensional non-linear finite element analysis simulation calculation is impractical; to make it practical, we have to determine the most critical solder joint based on the equivalent stress values within the solder joints according to Darveaux and Syed (2000). In this paper we also used a probabilistic approach to predict fatigue life of the most critical solder joint under Mechanical bending cycle; to use only a determinist approach is not enough because it neglects the variability of input parameters and this has an impact on the output result. The failure probability of the most critical solder joint of BGA packaging is defined using two methods of numerical study of probabilistic methods which are: The First and second Order Reliability Methods (FORM) and (SORM). Key words: Fatigue Life Prediction Solder Joints Mechanical Bending Damages BGA Packaging Failure Probability FORM SORM INTRODUCTION The goal of this paper is to determine a combined In most used microelectronic devices, a solder the fatigue failure of solder joints under a mechanical joint of BGA package electronic plays a crucial role cyclic bending loading environment [8-10]. because it provides mechanical and electrical connections In our study the failure of solder joints in BGA [1-7]. package is mainly caused by the stress generated by the In this study we are going to focus on the mechanical cyclic bending loading, besides the package reliability concerns of a solder joint of BGA package variables such as the package, the substrate, the die sizes, since BGA package is widely used in the electronic the number of solder joints, the DNP, the pitch and the industry. material proprieties. However, it is not simple to consider determinist and probabilistic simulation model to predict