Indonesian Journal of Electrical Engineering and Computer Science Vol. 10, No. 3, June 2018, pp. 980~988 ISSN: 2502-4752, DOI: 10.11591/ijeecs.v10.i3.pp980-988  980 Journal homepage: http://iaescore.com/journals/index.php/ijeecs Multilayer End Coupled Band Pass Filter using Low-temperature Co-fired Ceramic Technology for Broadband Fixed Wireless Zulkifli Ambak 1 , Hizamel M.Hizan 2 , Ahmad Ismat Abdul Rahim 3 , Azmi Ibrahim 4 , Mohd Zulfadli M. Yusoff 5 , Razali Ngah 6 1,2,3,4,5 Communication Technology, TM Research & Development Sdn Bhd, Lingkaran Teknokrat, 63000, Cyberjaya, Selangor, Malaysia 6 Wireless Communication Center, Faculty of Electrical Engineering, Universiti Teknologi Malaysia, 81310, Johor, Malaysia Article Info ABSTRACT Article history: Received Jan 5, 2018 Revised Mar 2, 2018 Accepted Mar 18, 2018 This paper presents design approach for realizing multilayer End Coupled Bandpass Filter (ECBPF) using low temperature co-fired ceramic (LTCC) technology at TMRND's LTCC Lab. Design method for the ECBPF is based on the coupled-resonator filter which was realized in LTCC multilayer substrate and operating at the center frequency of 42GHz. Three samples of EC BPF have been designed, simulated, fabricated and investigated in terms of performance and structure size. This multilayer ECBPF were fabricated in the 8 layers LTCC Ferro A6S materials with dielectric constant of 5.8, loss tangent of 0.002 and metallization of gold. The measured insertion loss for ECBPF was 2.43dB and return loss was 22.81dB at the center frequency at 42GHz. The overall size of the fabricated filter was 6.0 mm x 2.5 mm x 0.77 mm. Keywords: Broadband fixed wireless End coupled BPF LTCC Copyright © 2018 Institute of Advanced Engineering and Science. All rights reserved. Corresponding Author: Zulkifli Ambak, Communication Technologies, TM Research and Development Sdn Bhd, Lingkaran Teknokrat Timur, 63000, Cyberjaya, Selangor, Malaysia. Email: zulkifliambak@tmrnd.com.my 1. INTRODUCTION The rapid development in microwave and millimeter wave communication technology is demand for high quality, miniaturization, and low-cost fabrication of passive components such as the microstrip bandpass filters (BPF) and antennas. The next generation of wireless communication networks envisages operation at millimeter-wave frequencies (>30GHz) to achieve the high data speed where larger allocable bandwidth is available for gigabit/s transmissions.Several applications were developed in microwave and millimeter wave (mm-wave) band to achieve the high-speed data transmission including for mm-wave Radio over Fiber (RoF) application as reported in [1-3]. In general, the bandpass filter is one of an important passive component in microwave and millimeter wave communication system because of its function for permitting signal in the desired range of frequencies and rejecting all other. There are many filter topologies at microwave and mm-wave frequencies as reported such as the parallel-coupled-resonator filters [4] and the hairpin resonator filters [5] which have a problem with a large size, the high loss due to the increased resonator capacitance, low stopband rejection, and spurious response at the filter's harmonics.We need to use different feed topologies and multilayer structure to reduce the size and improve insertion loss such as parallel-coupled-feed structure [6], tapped-line [7], and the end-coupled structures [8].