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ELSEVIER Microelectronic Engineering 36 (1997) 107-110
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Blue and violet photoluminescence from high-dose Si ÷- and Ge÷-implanted silicon
dioxide layers
L. Rebohlea, I. E. Tyschenko b, H. Fr6b¢, K. Leo ~, R. A. Yankov*, J. yon Borany ~, G. A. Kachurinb and
W. Skomp#
Institut fiir Ionenstrahlphysik und Materialforschung, Forschungszentrum Rossendoff e.V., POB 510119,
D-01314 Dresden, Germany: Tel. :+49-351-2602068; Fax:+49-351-2603411; e-mail: rebohle@,fz-rossendorf.de
blnstitut fiir Halbleiterphysik, Russische Akademie der Wissenschaflen, Nowosihirsk, Russia
qnstitut fiir Angewandte PhotophysiL Technische Universi~'t Dresden, Mommsenstr. 13, D-01062 Dresden,
Germany
Strong blue (around 470 nm) and violet (around 395 nm) photoluminescence (PL) at room temperature
(RT) was obtained from thermally-grown SiO2 films on crystalline Si implanted with Si + and Ge + ions,
respectively Photoluminescence excitation (PLE) spectroscopy measurements indicate maximum PL at 248 nm
(for Si +) and 242 nm (for Ge+). The blue PL intensity was investigated as a function of subsequent furnace and
flash lamp annealing. The results obtained are interpreted in terms of the excess atoms introduced in the SiO2
network.
1. INTRODUCTION
SiO2 is of great importance as a passivating and
insulating material for the production of electronic
devices and belongs to the most widely investigated
compounds in science and technology. Recently it
has become clear that in a number of cases
impurity-rich SiO2 layers possess luminescing
properties. Since the discovery of PL from porous
silicon at RT, this topic has attracted increasing
interest for the development of Si-based
optoelectronic devices. One of the most promising
methods of producing luminescence centres in SiO2
films is the formation of non-stoichiometric layers
using Si- or Ge-implantation followed by annealing.
The advantages of this method are the precise
control over the number and distribution of the
implanted ions and its compatibility with current Si
technology.
Silicon-rich SiCh layers have been found to emit
red PL [1,2]. Recent studies have demonstrated the
possibility of achieving blue PL (410-460 nm) from
silicon-rich SiO2 layers [3-5]. In order to obtain
consistent information on the nature of blue and
violet PL from Ge +-, Ar+- and Si+-implanted SiCh,
we have investigated the influence of both the
implanted species and annealing conditions on the
PL efficiency.
2. EXPERIMENTAL
Thermally-grown, 500 nm thick SiO2 films on
(100) n-type Si wafers were implanted with Si +, Ge +
and Ar + using a beam current density in the range
of 0.5 to 1.0 gA cm"2. More specifically, Si + ions
were implanted first at an energy of 200 keV to a
dose of 3.0x1016 cm"2 and then at 100 keV to a dose
of 1.gxl0 ~6 cm"2. Double-energy implantation was
similarly performed for Ge + at 350 keV and 200
keV tO doges of 2.8x1016 cm "2 and 1.8x10 ~6 cm"2,
respectively. Ar+ ions were implanted to doses of
3.0x1016 cm"2 (250 keV) and 1.5x1016 cm"2 (170
keV). The implant energies and doses were chosen
in such a way as to achieve one and the same
concentration and depth location of the implanted
ions. According to TRIM calculations, these
distributions would be nearly fiat-topped within a
depth region of 100 to 400 nm below the oxide
surface. The substrate temperature during
implantation was kept between -120°C and -150°C
by mounting the wafers on a LN2-cooled stage,
After implantation the wafers were cut into
segments and annealed using two different
procedures. One set of Si-implanted samples was
heat-treated by furnace annealing (FA) for 30 rain
at temperatures ranging from 300°C to 700°C,
whereas another one was subjected to flash-lamp
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