Ceramic Based Novel Multilayer and Miniaturized RF/Millimetre-Wave Components and Highly Integrated Mm-Wave Modules Kamal K. Samanta 1, 2 1 Milmega/Teseq Ltd, Ryde, Hampshire, PO33 2DD, England 2 Institute of Microwaves and Photonics, University of Leeds, Leeds, LS2 9JT, UK; E. mail: kksamanta@ieee.org Abstract—This paper describes the realization of novel multilayer miniaturized and high performance passive components, covering a wide frequency range (RF to millimeter-wave), and a highly compact millimeter-wave sub- systems at a low cost using advanced multilayer ceramic based photoimageable thick film technology. The multilayer miniaturized passive components have been designed using meander-line and lumped-distributed approach, and characterized covering IF (2GHz) as well as RF (> 80 GHz) frequencies for a complete system. At the same time compact and high-Q multilayer lumped components have been designed and modeled up to mmW frequency with excellent performance. Lumped element filters have remarkably low pass band loss with high stop band attenuation and miniaturization. These performances are better than most of the reported results from conventional multichip module (MCM) technologies. Further, using a new integration technique, where IC mounting cavities are formed from trench-vias and have precise dimensional control, a mmW modules are realized onto a single substrate integrating MMICs with RF (V-band) SIW components and embedded lumped element (IF) low-pass filter and other passives in bias network with high performance and compactness. Keywords-Photoimageable thick-film, multilayer MCM, Miniaturised mm-wave components, SIW, multi-chip modules I. INTRODUCTION Ever growing demands and emerging applications of microwave and millimeter-wave (mmW) frequencies requires development of compact systems with high performance at a reasonable cost. Multilayer/3D multichip module (MCM) and System-on/in-package (SoP/SiP) technologies have been widely accepted as an excellent stand for realizing compact modules/systems meeting ever growing product functionality [1, 2]. Miniaturisation is one of the key requirements in an MCM where passive elements play a very important role. The ever growing number of passive components generally used in a circuit typically represents more than 80% of the total part count. To meet the miniaturization and performance requirement of a complete MCM system (like a transceiver) it is very essential to realize high quality passive components to cover RF (mmW) as well as IF frequencies of the system. For a passive structure, like coupler, filter, inductor etc., the performance and the successful realisation are determined by the fine line/gap and via resolutions. Out of different MCM techniques, ceramic-based MCM is very mature and attractive. But when conventional thick-film technology is used, it is very difficult to achieve fine conductor geometry or trench via to realize compact lumped elements and passives, or SIW components with required performance for system applications beyond 40GHz; and at the same time the limitation of the fabrication process restrict the realisation of passives covering from low (IF) to high RF (millimetre-wave) frequencies, with required quality and miniaturization. To address the lack of precision and miniaturization, recently developed advanced multilayer thick-film photoimageable technologies is found to be very promising and suitable for meeting the demanding requirement for covering IF to mm-wave and sub-mmW frequencies. The processing is straightforward, and yet line widths of 15μm can be realized comfortably [2, 4]. Moreover, due to the thinness of the dielectric, meander-line based components can be realised at lower (IF) frequencies within as compact size, beside mmW components. Therefore, in this paper ceramic based photoimageable/photodefinable thick film technology has been used for realizing a wide range of novel multilayer and planar /meandered lumped and passive components (2 to 80 GHz), circuits and complete mm-wave modules/receiver with remarkably high performance and miniaturization, and hence demonstrating the high suitability of the technology for realizing RF to mm-wave components to a highly integrated systems at a low cost [3]. II. HIGHLY MINIATURISED PASSIVE COMPONENTS COVERING A WIDE RANGE (IF TO RF/MMW ) OF FREQUENCIES The test structures were fabricated using multiple layers of advanced photoimageable thick-film pastes [2-5] on a ceramic (Alumina) base substrate using a conventional off- contact screen printer. Layers of photoimgeable dielectric paste and low loss silver conducting paste (HC4700) are printed alternately to form the required height of dielectric. 978-1-4799-3403-4/14/$31.00 ©2014 IEEE