Permission to make digital or hard copies of all or part of this work for
personal or classroom use is granted without fee provided that copies are
not made or distributed for profit or commercial advantage and that
copies bear this notice and the full citation on the first page. To copy
otherwise, to republish, to post on servers or to redistribute to lists,
requires prior specific permission and/or a fee.
DAC'11, June 5-10, 2011, San Diego, California, USA
Copyright © 2011 ACM 978-1-4503-0636-2/11/06...$10.00
Common-Centroid Capacitor Placement Considering
Systematic and Random Mismatches in Analog Integrated Circuits
Cheng-Wu Lin, Jai-Ming Lin, Yen-Chih Chiu, Chun-Po Huang, and Soon-Jyh Chang
Department of Electrical Engineering, National Cheng Kung University, Tainan, Taiwan, R.O.C.
lcw@sscas.ee.ncku.edu.tw; jmlin@ee.ncku.edu.tw; chew@livemail.tw; gppo@sscas.ee.ncku.edu.tw; soon@mail.ncku.edu.tw
ABSTRACT
One of the most important issues during the analog layout phase
is to achieve accurate capacitance ratios. However, systematic and
random mismatches will affect the accuracy of the capacitance
ratios. A common-centroid placement is helpful to reduce the
systematic mismatch, but it still needs the property of high
dispersion to reduce the random mismatch [10]. To deal with this
problem, we propose a simulated annealing [15] based approach
to construct a common-centroid placement which exhibits the
highest possible degree of dispersion. To facilitate this framework,
we first propose the pair-sequence representation to represent a
common-centroid placement. Then, we present three operations to
perturb the representation, which can increase the degree of
dispersion without breaking the common-centroid constraint in
the resulting placement. Finally, to enhance the efficiency of our
simulated annealing based approach, we propose three techniques
to speed up our program. The experimental results show that our
placements can simultaneously achieve smaller oxide-gradient-
induced mismatch and larger overall correlation coefficients (i.e.,
higher degree of dispersion) than [10] in all test cases. Besides,
our program can run much faster than [10] in larger benchmarks.
Categories and Subject Descriptors: B.7.2 [Integrated Circuits]:
Design Aids – Layout, Placement and routing
General Terms: Algorithms, Design
Keywords: Analog placement, capacitor array
1. INTRODUCTION
The key performance of many analog integrated circuits (ICs)
is related to the accuracy of capacitance ratios [3, 4, 10], such as
analog-to-digital converters and switched-capacitor circuits [2].
Among these circuits, a successive-approximation-register (SAR)
analog-to-digital converter (ADC) has attracted more attention
recently due to its low power consumption (see Figure 1), and it is
widely used in biomedical chips or portable/battery-powered
instruments. One of the most important components in the SAR
ADC is a capacitor array, which contains a set of capacitors
C
1
, …, C
n+1
and these capacitors have to satisfy a predefined
capacitance ratio (i.e., C
1
= C
2
, C
i+1
= 2C
i
, i = 2, …, n). A
capacitor array is considered matched if its capacitance ratio
exactly meets the predefined value. The linearity of the SAR
ADC is highly related to the matching of the capacitor array.
A well-matched capacitor array may become mismatched
after IC manufacturing. The causes of mismatch in IC fabrication
process can be divided into two categories: systematic mismatch
and random mismatch [3, 4]. We illustrate each of them in the
following:
In the category of systematic mismatch, mechanisms have
equal effects on each device. Thus, if two devices have identical
layout size, they suffer the same percentage of difference from the
mechanisms, which implies that the two devices still keep
matched. Therefore, given a set of devices with different layout
sizes, designers prefer to divide every device into several
identical-layout-size sub-devices to achieve matching. However,
the presence of process gradients also causes systematic mismatch
[5]. If two devices have identical layout size but they are placed
far away from each other in a layout, they would experience
unequal magnitude of effects due to the process gradients and thus
exhibit mismatch. Therefore, for a set of devices which require
matching, they should be placed close to each other in a layout.
Further, these devices should exhibit symmetry in the layout to
average the effects induced by process gradients. In order to
reduce systematic mismatch, designers usually adopt a common-
centroid layout structure [1] to achieve these considerations.
On the other hand, random mismatch is caused by statistical
fluctuations in processing conditions or material properties. Since
these fluctuations are random mechanisms, the sub-devices of
each device should be distributed throughout a layout as
uniformly as possible to reduce random mismatch, which means
that the sub-devices should exhibit the highest possible degree of
dispersion in a layout [10].
Figures 2(a) and 2(b) show two placements for a capacitor
array according to different layout considerations. The capacitor
u
4
u
4
u
4
u
3
u
3
u
4
u
4
u
4
u
4
u
3
u
3
u
2
u
1
u
3
u
3
u
4
u
4
u
3
u
3
u
4
u
2
u
3
u
3
u
4
u
4
u
4
u
4
u
4
u
4
u
4
u
3
u
3
u
3
u
4
u
4
u
3
u
3
u
3
u
4
u
4
u
4
u
4
u
4
u
4
u
4
u
4
u
4
u
4
u
4
u
4
u
4
u
4
u
4
u
4
u
4
u
4
u
4
u
4
u
4
u
4
u
4
u
4
u
4
u
4
u
4
u
4
u
4
u
3
u
3
u
4
u
4
u
4
u
4
u
3
u
3
u
2
u
1
u
3
u
3
u
4
u
4
u
3
u
3
u
4
u
2
u
3
u
3
u
4
u
4
u
4
u
4
u
4
u
4
u
4
u
3
u
3
u
3
u
4
u
4
u
3
u
3
u
3
u
4
u
4
u
4
u
4
u
4
u
4
u
4
u
4
u
4
u
4
u
4
u
4
u
4
u
4
u
4
u
4
u
4
u
4
u
4
u
4
u
4
u
4
u
4
u
4
u
4
u
4
u
4
u
3
u
3
u
2
u
3
u
4
u
4
u
4
u
4
u
3
u
4
u
4
u
1
u
4
u
3
u
4
u
4
u
4
u
3
u
3
u
2
u
3
u
4
u
4
u
4
u
4
u
3
u
3
u
4
u
4
u
3
u
4
u
3
u
4
u
4
u
3
u
4
u
4
u
4
u
4
u
3
u
4
u
3
u
4
u
4
u
4
u
4
u
4
u
4
u
4
u
4
u
4
u
4
u
3
u
4
u
4
u
4
u
4
u
4
u
4
u
4
u
4
u
4
u
4
u
4
u
3
u
3
u
2
u
3
u
4
u
4
u
4
u
4
u
3
u
4
u
4
u
1
u
4
u
3
u
4
u
4
u
4
u
3
u
3
u
2
u
3
u
4
u
4
u
4
u
4
u
3
u
3
u
4
u
4
u
3
u
4
u
3
u
4
u
4
u
3
u
4
u
4
u
4
u
4
u
3
u
4
u
3
u
4
u
4
u
4
u
4
u
4
u
4
u
4
u
4
u
4
u
4
u
3
u
4
u
4
u
4
u
4
u
4
u
4
u
4
u
4
u
4
u
4
(a) (b)
Figure 2. Two different placements for a capacitor array. The unit
capacitors denoted by u
3
are colored in gray for a clearer exhibition of
different placement styles. (a) A common-centroid placement is good
for reducing systematic mismatch. (b) The placement [10] exhibiting a
higher degree of dispersion is better for reducing random mismatch.
SAR
Logic +
−
C
n+1
C
1
C
2
C
3
C
n
V
ref
V
in
CLK
B
1
~B
n
Capacitor array (C
1
=C
2
, C
i+1
=2C
i
, i=2~n)
SAR
Logic +
−
C
n+1
C
1
C
2
C
3
C
n
V
ref
V
in
CLK
B
1
~B
n
Capacitor array (C
1
=C
2
, C
i+1
=2C
i
, i=2~n)
Figure 1. Architecture of an n-bit SAR ADC. The linearity of the
SAR ADC is highly related to the matching of the capacitor array.
528
29.3