Accepted Manuscript
Regular paper
Microstrip Broadband Thin-Film Attenuators without Via-hole-ground at Mil-
limeter Wave Frequencies
Beatriz Aja, Eduardo Artal, Enrique Villa, Luisa de la Fuente, Juan Pablo
Pascual
PII: S1434-8411(18)31926-5
DOI: https://doi.org/10.1016/j.aeue.2019.01.005
Reference: AEUE 52637
To appear in: International Journal of Electronics and Communi-
cations
Received Date: 17 July 2018
Revised Date: 14 November 2018
Accepted Date: 4 January 2019
Please cite this article as: B. Aja, E. Artal, E. Villa, L. de la Fuente, J. Pablo Pascual, Microstrip Broadband Thin-
Film Attenuators without Via-hole-ground at Millimeter Wave Frequencies, International Journal of Electronics
and Communications (2019), doi: https://doi.org/10.1016/j.aeue.2019.01.005
This is a PDF file of an unedited manuscript that has been accepted for publication. As a service to our customers
we are providing this early version of the manuscript. The manuscript will undergo copyediting, typesetting, and
review of the resulting proof before it is published in its final form. Please note that during the production process
errors may be discovered which could affect the content, and all legal disclaimers that apply to the journal pertain.
© 2019. This manuscript version is made available under the CC-BY-NC-ND 4.0 license
http://creativecommons.org/licenses/by-nc-nd/4.0/