2156-3950 (c) 2019 IEEE. Personal use is permitted, but republication/redistribution requires IEEE permission. See http://www.ieee.org/publications_standards/publications/rights/index.html for more information. This article has been accepted for publication in a future issue of this journal, but has not been fully edited. Content may change prior to final publication. Citation information: DOI 10.1109/TCPMT.2019.2935477, IEEE Transactions on Components, Packaging and Manufacturing Technology 1 Electrical, Thermal and Mechanical Characterization of eWLB, Fully-Molded Fan-Out Package and Fan-Out Chip Last Package Meng-Kai Shih, Chih-Yi Huang, Tsan-Hsien Chen, Chen-Chao Wang, David Tarng, and CP Hung Advanced Semiconductor Engineering (ASE) Inc. Kaohsiung, Taiwan (ROC) e-mail:Mengkai_shih@aseglobal.com Abstract Fan-Out (FO) packages are widely used in handheld, mobile consumer, and Internet of Things (IoT) devices due to the facility they provide for a greater I/O density and the integration of multiple components in a single package. Various types of FO package are available, including Embedded Wafer Level BGA (eWLB), Fully-Molded (FM), and a flip chip based structure referred to as Fan-Out Chip-Last (FOCLP). In this paper, ANSYS simulations are performed to examine the warpage, extreme low-k (ELK) interconnect stress, and board level solder joint reliability of the various package types. The validity of the simulation model is confirmed by comparing the numerical results for the warpage of the eWLB and FM packages with the experimental observations. Further simulations are then performed to investigate the heat dissipation performance and electrical cross-talk properties of the three packages. Taguchi experiments are conducted to examine the effects of eight control factors (namely the inclusion (or otherwise) of a backside laminate film, the board thickness, the joint standoff distance, the ball joint diameter, the UBM diameter, the joint pitch, the die thickness, and the Cu pillar height) on the thermomechanical reliability of the