UCC Library and UCC researchers have made this item openly available. Please let us know how this has helped you. Thanks! Title Selective electroless nickel deposition on copper as a final barrier/bonding layer material for microelectronics applications Author(s) Rohan, James F.; O'Riordan, Gerald; Boardman, Jane Publication date 2001-12-11 Original citation Rohan, J. F., O’Riordan, G. and Boardman, J. (2002) 'Selective electroless nickel deposition on copper as a final barrier/bonding layer material for microelectronics applications', Applied Surface Science, 185(3), pp. 289-297. doi: 10.1016/S0169-4332(01)00982-5 Type of publication Article (peer-reviewed) Link to publisher's version http://www.sciencedirect.com/science/article/pii/S0169433201009825 http://dx.doi.org/10.1016/S0169-4332(01)00982-5 Access to the full text of the published version may require a subscription. Rights © 2002 Published by Elsevier Science B.V. This manuscript version is made available under the CC-BY-NC-ND 4.0 license http://creativecommons.org/licenses/by-nc-nd/4.0/ Item downloaded from http://hdl.handle.net/10468/7623 Downloaded on 2021-11-27T07:23:50Z