Accepted Manuscript Microstructural evolution and properties of TLP diffusion bonding super-Ni/NiCr laminated composite to Ti-6Al-4V alloy with Cu interlayer Kun Liu, Yajiang Li, Chunzhi Xia, Juan Wang PII: S0264-1275(17)30870-5 DOI: doi: 10.1016/j.matdes.2017.09.028 Reference: JMADE 3361 To appear in: Materials & Design Received date: 16 April 2017 Revised date: 12 September 2017 Accepted date: 13 September 2017 Please cite this article as: Kun Liu, Yajiang Li, Chunzhi Xia, Juan Wang , Microstructural evolution and properties of TLP diffusion bonding super-Ni/NiCr laminated composite to Ti-6Al-4V alloy with Cu interlayer, Materials & Design (2017), doi: 10.1016/ j.matdes.2017.09.028 This is a PDF file of an unedited manuscript that has been accepted for publication. As a service to our customers we are providing this early version of the manuscript. The manuscript will undergo copyediting, typesetting, and review of the resulting proof before it is published in its final form. Please note that during the production process errors may be discovered which could affect the content, and all legal disclaimers that apply to the journal pertain.