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Thin Solid Films
journal homepage: www.elsevier.com/locate/tsf
Preface proceedings of the 7th International Conference on Microelectronics and Plasma
Technology (ICMAP 2018), Incheon, Korea
The International Conference on Microelectronics and Plasma
Technology (ICMAP) was initiated in 2008 at Jeju, Korea, to provide an
open forum for discussing research and developments in plasma-related
fields. Since the first ICMAP in 2008, ICMAP 2009, 2011, 2012, 2014
and 2016 were held in Busan (Korea), Dalian (China), Jeju (Korea),
Gunsan (Korea), and Geongju (Korea), respectively. ICMAP 2018 (July
24–28, Incheon, Korea) was held jointly with APCPST 2018 (The 14th
Asia Pacific Conference on Plasma Science and Technology) and ISPB
2018 (The 8th International Symposium on Plasma Biosciences 2018).
The conference, ICMAP 2018, was organized to discuss the state-of-the-
art of scientific and technological achievements in plasma R&D activ-
ities for advanced applications and the newly emerging fields of plasma
technology.
In ICMAP 2018, the topics included a variety of plasma processing
technologies for thin films, nanomaterials, and atomic layer etching for
semiconductor, display, energy, and sensor devices. In addition, the
development of new plasma technologies including plasma farming,
plasma medicine for skin and cancer applications, plasma biomaterials,
and environment was extensively discussed. New plasma source tech-
nology was an important topic for advanced applications.
This Special Issue of Thin Solid Films contains peer-reviewed papers
presented at ICMAP 2018 and selected from a total of 483 presentations
including 121 invited talks, 65 contributed talks, and 297 posters.
The organizing committee would like to express sincere thanks to
organizing members, all institutions and companies that offered es-
sential support and sponsorship, and all the participants contributing to
the success of ICMAP 2018.
Organizers
The Korean Vacuum Society.
Plasma Bioscience Research Center.
Applied Plasma Medicine Center.
Global Elite Cultivation Center for Emergent Materials (Brain Korea
21
+
).
Sponsors
Lam Research Corporation.
SEMES.
ICD
Tokyo Electron (TEL), Co., Ltd.
Jusung Engineering, Co., Ltd.
KW Tech.
WONIK IPS Co., Ltd.
SNTEK Co., Ltd.
Edwards Co., Ltd.
The Korean Federation of Science and Technology Societies
(KOFST).
Incheon Metropolitan City.
Incheon Tourism Organization.
Korea Tourism Organization.
Supporting organization
American Vacuum Society.
Plasma Technology Research Center at National Fusion Research
Institute (NFRI).
Honorary chairman
Chi Kyu Choi, Jeju Nat'l Univ., Korea.
Conference chairman
Geun Young Yeom, Sungkyunkwan Univ., Korea.
Suk Jae Yoo, Nat'l Fusion Research Inst., Korea.
Eun Ha Choi, Kwangwoon Univ., Korea.
General secretaries
HeeHwan Choe, Korea Aerospace Univ., Korea.
Shin Jae You, Chungnam Nat'l Univ., Korea.
Deuk-Chul Kwon, Nat'l Fusion Research Inst., Korea.
Hyo-Chang Lee, KRISS, Korea.
Organizing committee
Chi-Kyu Choi, Honorary Chair.
Geun Young Yeom, Conference Chair.
Suk Jae Yoo, Conference Chair.
Eun Ha Choi, Conference Chair.
Hong Young Chang, International Organizing Chair.
J. E. Greene, International Advisory Committee Chair.
https://doi.org/10.1016/j.tsf.2019.03.027
Thin Solid Films 680 (2019) 37–39
Available online 10 April 2019
0040-6090/ © 2019 Elsevier B.V. All rights reserved.
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