Conference and Exhibition of the European Association of Virtual and Augmented Reality (2014) G. Zachmann, J. Perret, and A. Amditis (Editors) Haptic Devices Evaluation for Industrial Use R. Iacob 1 & D. Popescu 1 & F. Noel 2 & T. Louis 2 & C. Masclet 2 & P. Maigrot 2 1 University Politehnica of Bucharest, Romania 2 Univ. Grenoble Alpes, G-SCOP, F-38000 Grenoble, France CNRS, G-SCOP, F-38000 Grenoble, France Abstract The current study concerns the Assembly/Disassembly (A/D) process. Despite the latest improvements, the creation of a fully realistic VE is still challenging because of the complexity of the physical processes involved and the current limitations of the available VR technology. In this context, the main purpose of this research is to improve the A/D process simulation by proposing a new method and associated tools, as well as a better integration with haptic devices. To this end, the first objective, regarding the software application, is to develop and evaluate the impact of a mobility module based on predefined kinematic constraints between the assembly components, able to guide user’s movements when performing A/D operations simulation. This can be achieved through the intelligent management of the assembly components relative mobilities in contact situations. The second objective, regarding the hardware aspects, is to determine if the described approach, along with a new moderate cost haptic system, could represent an interesting solution for industrial use. In this sense, a comparison between the A/D simulation qualities provided by two commercial haptic devices (basic equipment with 3 DoF force feedback versus an expensive system with 6 DoF force feedback) was performed and it is presented in this paper. Conclusions were drawn after series of tests conducted by a target group composed of 20 people with engineering background. Categories and Subject Descriptors (according to ACM CCS): Categories and Subject Descriptors (according to ACM CCS): H.5.2 [User Interfaces] - Haptic I/O 1. Introduction Realtime simulation platforms play an increasingly impor- tant role in our everyday life. These tools were initially used in immersive video games where players are put in sce- narios allowing them to develop skills useful also, some- times, in managing real life situations. The same type of approach is now transferred to domains like engineering or medicine, virtual training environments being created and implemented for developing and improving a diversity of skills. In many VEs (Virtual Environments), emphasis is mostly given to visual and auditory displays [ZFS*05], little tac- tile feedback information being provided. Therefore, haptic technology can represent, in some way, the third dimension of any immersive platform, essentially contributing to the user’s perception of immersion. In recent years, many ap- plications have been developed, ranging from portraying an unfolding (open) story [LBS13], training of complex prod- ucts assembly [XLR*12], nanoscale phenomena simulation [MLB*08] to simulations in neurosurgery [CCS*13]. As known, the use of haptic devices usually involves col- lision detection in realtime, and effort generation where the collisions are taking place. In a significant number of cases this leads to an exponential increase of the required comput- ing resources or to a relatively low quality simulation. Thus, there is a strong need for new development paths for the ex- isting software, as well as for new and more affordable hard- ware solutions, especially for mechanical engineering appli- cations, of interest in our research. In the engineering field, one of the most prolific research areas is represented by the A/D process simulation. Great challenges pertain to this area due to the growing concern of environmental impact of the product in the latter phases of its lifecycle. Here two types of approaches are prevalent: • Virtual manual assembly: methods that allow users to manipulate virtual components in a natural and effec- c  The Eurographics Association 2014. DOI: 10.2312/eurovr.20141337