Accepted Manuscript Roles of palladium particles in enhancing the electrochemical migration resist- ance of sintered nano-silver paste as a bonding material Di Wang, Yun-Hui Mei, Haining Xie, Kun Zhang, Kim S. Siow, Xin Li, Guo- Quan Lu PII: S0167-577X(17)30958-8 DOI: http://dx.doi.org/10.1016/j.matlet.2017.06.066 Reference: MLBLUE 22778 To appear in: Materials Letters Received Date: 22 April 2017 Revised Date: 9 June 2017 Accepted Date: 13 June 2017 Please cite this article as: D. Wang, Y-H. Mei, H. Xie, K. Zhang, K.S. Siow, X. Li, G-Q. Lu, Roles of palladium particles in enhancing the electrochemical migration resistance of sintered nano-silver paste as a bonding material, Materials Letters (2017), doi: http://dx.doi.org/10.1016/j.matlet.2017.06.066 This is a PDF file of an unedited manuscript that has been accepted for publication. As a service to our customers we are providing this early version of the manuscript. The manuscript will undergo copyediting, typesetting, and review of the resulting proof before it is published in its final form. Please note that during the production process errors may be discovered which could affect the content, and all legal disclaimers that apply to the journal pertain.